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Thermal Dissipation of I210

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I'm using the I210 on a hot ambient and I need more specific Thermal resistance Juntion to Case value and Max Operational Juntion Temperature.

 

I don't trust on the Datasheet's Thermal resistance Juntion Top Case because it state 0.06 no airflow and 0.63 3ms of airflow, how could it be possible?

Also I don't understand the table 13-24, It is using the thermal resistance juntion ambient to get the case temperature, but if you use the Juntion Ambien resistance you will get the juntion temperature rather than the case temperature.

 

Could you confirm the Max Operational Juntion Temperature and also the Thermal resistance Juntion to Case?


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