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Utilizing DFI’s 6th Gen Intel® Core™ Industrial-Grade Boards to Meet the Needs of Vertical Applications

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Utilizing DFI’s 6th Gen Intel® Core™ Industrial-Grade Boards
to Meet the Needs of Vertical Applications


DFI, a leading provider offering a wide range of embedded  products for industrial applications, is introducing thirteen industrial motherboards based on the 6th Generation Intel® Core™ processor family  (codename Skylake) and built on Intel’s new 14nm process technology. DFI's board lineup covers a range of platforms including: powerful workstations, cost-effective desktops, and low thermal U-series processors to satisfy various requirements in embedded applications.


New Series of Workstation Boards for Entry-Level Servers
DFI's new series of workstation motherboards feature the latest Intel® Xeon® processor E3-1200 v5 product family under Intel®C236 chipset to offer new options for entry-level server and workstation applications. This new series has an upgraded 64 GB DDR4 memory that enables accelerated exploration of complex data and provides dramatic improvements in graphics capabilities to optimize business. In addition, these boards support enhanced ECC memory and Intel® vPro™ technology to make sure servers are secure, manageable, and highly reliable for 24/7 operation.

Workstation Products: SD631-C236, SD331-C236


SD631-C236 ATX Board for Broadcasting Control Center

 

 


Complete Desktop Product Line for Industrial Control
DFI has designed a comprehensive product line of desktop platforms with the latest Intel® Q170/H110 chipset and LGA1151 socket (which supports 6th Gen Intel® Core™/Pentium®/Celeron® processors). These embedded boards are equipped with intensive computing, graphics, and flexible I/O capabilities in variable forms (ATX/microATX/Mini-ITX) to make these boards an ideal controller for industrial automation machines in smart factory. Due to the advanced I/O expandability (up to 10 USB 3.0 ports, 6 SATA 3.0 ports, and 20 Gen 3 PCIe lanes support), this product line is able to seamlessly connect industrial legacy devices to the IoT cloud. Thus, the users are able to monitor manufacturing processes remotely and improve factory’s productivity and reliability.

Desktop Products: SD631-Q170, SD630-H110, SD331-Q170, SD330-Q170, SD330-H110, SD100-Q170, SD101/SD103-Q170,SD100-H110, SD101/SD103-H110

SD330-Q170 microATX Board for Machine Vision

 

 


Low-Power U-series Boards for Smart Healthcare
DFI's Mini-ITX and 3.5” SBC boards (powered by 6th Gen Intel® Core™ U-series processor) provide high performance with low thermal design power (15 watts TDP) in a compact size. Moreover, the low-power boards are packed with state-of-the-art Intel®HD graphics which support triple independent displays, ultra-immersive 2D/3D video processing capabilities, and 4K high definition. These features make the boards suitable for space-constrained and graphics demanding solutions such as patient monitor, broadcasting system, and ultrasound medical imaging in smart healthcare.

ULT Products: SU171/SU173, SU551

 


SU171 Mini-ITX Board for Medical Application

 

 

"As a leading provider of embedded solutions, we deployed a comprehensive product lineup to help our customer’s time-to-market utilizing the latest Intel embedded technology in a wide range of vertical applications. Moreover, these DFI’s industrial-grade products guarantee 7-year life cycle support which ensures long-term availability and partnership with our customers" said Victor Huang, Product Manager at DFI.

Contact Us

DFI Inc.

 

10F, No.97, Sec.1, Xintai 5th Rd., Xizhi Dist., New Taipei City 22175, Taiwan (R.O.C.)
+886 (2) 2697 2986  inquiry@dfi.com.tw

 

DFI-ITOX, LLC
15 Corporate Place South, Suite 201, Piscataway, NJ 08854, USA
+1 (732) 390 2815 
www.dfi-itox.com/estore

 

DFI B.V.
Klompenmakerstraat 89, 3194 DD Rotterdam-Hoogvliet, The Netherlands
+31 (10) 296 1840

DFI Co., Ltd.
5F Dai2 Denpa Bldg. 2-14-10 Sotokanda Chiyoda-ku, Tokyo 101-0021, Japan
+81 (3) 5209 1081

Yan Ying Hao Trading Co. Ltd. (ShenZhen)
Room 505, 5th Floor, Building D, Hua Chuang Da Central Business Building,
Bao'an Road, Bao'an 42th District, ShenZhen, China
+86 (0755) 2372 9390

Full Press Release: Utilizing DFI’s 6th Gen Intel® Core™ Industrial-Grade Boards  to Meet the Needs of Vertical Applications

 


Upgrade your Embedded System with DFI’s 6th Gen Intel Core Processor-based COM Express Type 6

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Upgrade your Embedded System with
DFI’s 6th Gen Intel Core Processor-based COM Express Type 6

DFI, a leading provider offering a wide range of embedded products for industrial applications, today introduces its latest three COM Express Type 6 modules powered by the 6th Generation Intel® Core™ processor family (codename Skylake), including Intel® Mobile-based Basic – SH960-QM170 and SH960-HM170, and U series SoC-based Compact – SU968. The Mobile-based modules features enhanced graphics performance and high computing while ULT-based module features low power and fanless design making them well suited for industrial application in gaming, medical, digital signage, and factory automation.


The Mobile-based Module with High-Performance Graphics for Gaming Application
With more and more requirements in the gaming market, gaming machine manufacturers continue to search for the right solution to obtain rich immersive graphics and performance that end users come to expect today. Aimed at the application, DFI developed COM Express Basic based on mobile platform featuring super-fast 2133 DDR4 memory up to 32 GB for faster data transfer and 3 independent displays with high resolution (HDMI/DP++/eDP supports up to 4K x 2K) for greater gaming experience.

 

 

The ULT-based Module with High-Resolution Output and Low Power Design for Ultrasound Application
Ultrasound imaging devices are widely used in tumor treatment and the practice of examining pregnant women nowadays. In order to meet the growing demands in the medical field, DFI SU968 provides a low-power 15W TDP with fanless design featuring and high-performance 6th generation Intel Core processor that supports high-resolution output to boost graphics capability in ultrasound application.

 

 

“Computer-On-Module is one of the popular choices for machine manufacturers and system integrators to design application-specific solutions. In order to reduce our customers’ development time and work, DFI provides time-to-market standard COM Express as well as OEM/ODM customized services, including module design assistance and evaluation during planning phase, strict validation and testing process for deployments, and customized COM Express thermal solution design for special requirements. With more than 34 years of professional experience in research, design and manufacture, DFI can handle those complex technical issues and become your reliable partner.” said Victor Huang, Product Manager at DFI.

 


Contact Us

DFI Inc.

 

10F, No.97, Sec.1, Xintai 5th Rd., Xizhi Dist., New Taipei City 22175, Taiwan (R.O.C.)
+886 (2) 2697 2986  inquiry@dfi.com.tw  

 

DFI-ITOX, LLC
15 Corporate Place South, Suite 201, Piscataway, NJ 08854, USA
+1 (732) 390 2815 
www.dfi-itox.com/estore

 

DFI B.V.
Klompenmakerstraat 89, 3194 DD Rotterdam-Hoogvliet, The Netherlands
+31 (10) 296 1840

DFI Co., Ltd.
5F Dai2 Denpa Bldg. 2-14-10 Sotokanda Chiyoda-ku, Tokyo 101-0021, Japan
+81 (3) 5209 1081

Yan Ying Hao Trading Co. Ltd. (ShenZhen)
Room 505, 5th Floor, Building D, Hua Chuang Da Central Business Building,
Bao'an Road, Bao'an 42th District, ShenZhen, China
+86 (0755) 2372 9390

Full Press Release: Upgrade your Embedded System with  DFI’s 6th Gen Intel Core Processor-based COM Express Type 6

 

Introducing DFI’s Low Power Embedded Boards with Optimized and Thin-Profile Designs

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Introducing DFI’s Low Power Embedded Boards
with Optimized and Thin-Profile Designs

DFI (a leading provider offering a wide range of embedded  products for industrial applications) announced four new embedded boards today, and it includes: two Mini-ITX motherboards, one single board computer (SBC), and one 2.5” Pico-ITX powered by the latest Intel® Pentium®/Celeron® processor N3000 family. Based on this new low power platform, designed for mid to entry level systems, these boards deliver enhanced graphics capabilities and premium performance averaging just 6 watts TDP. That makes these boards the ideal solution for a whole range of fanless and energy-saving embedded applications such as industrial automation, retail industries, and healthcare.


Low-Profile Mini-ITX Boards for Overall Retail Systems
DFI’s BW171 and BW173 Mini-ITX motherboards are designed with only 25mm in height and include a variety of I/O connectivity. In addition, the optional power connectors (including right angle connector, vertical type connector, and DC-in jack) are available for customers to easily assemble their all-in-one thin systems. The two thin Mini-ITX also support three independent displays, VGA+LVDS+DP++, with Intel® HD graphics to deliver up to 3840x2160 high resolution. Thanks to the above features, BW171 and BW173 are suitable for universal retail applications as digital signage, vending machines, and small POS systems.

 

 

Small Form Factor Boards Designed for Fanless Healthcare
The BW051 is the all new Pico-ITX form factor measuring at 100mm x 72mm with DFI’s SBC platform design, and it features a small-sized mainboard to easily integrate into various space-limited applications with substantial I/O requirements. Additionally, DFI’s new embedded SBC boards, BW551 and BW051, are equipped with proprietary optional heat spreader with low thermal dissipation to satisfy fanless and mobile system integrations. These embedded boards also offer flexibility with multiple expansion interfaces: PCIe x1 slot, mSATA slot, Mini PCIe slot, and SIM card socket to expand and fulfill diversified computing applications such as: portable medical devices and fanless healthcare panel PCs.



DFI’s embedded boards are specially designed by industrial-grade components with 100% Japanese CAP and polymer capacitors to ensure long product lifecycle and MTBF. Furthermore, the 15k high ESD protection on all I/O ports prevents any damages to the internal components from static electricity and ensures system’s robustness in harsh environments. DFI also provides a high-qualified testing environment in thermal cycle testing, thermal profile temperature, and capacitor temperature for all heat-generated parts. With these rich features, the four new board-level products comprehensively satisfy most of the embedded smart solutions.

DFI’s Embedded Boards Based on
Intel® Pentium®/Celeron® Processor N3000 Family

 


 


About DFI

Established in 1981, DFI is a leading supplier of high-performance computing technology worldwide. With more than 34 years of experience, DFI focuses on innovative design and manufacture of leading-edge board and system level products for embedded applications requiring strict revision control and long life availability. DFI uses the latest technology platforms and manufacturing techniques to produce cost-effective products for use in medical diagnostic & imaging, ATM/POS, industrial control, kiosk, security & surveillance, digital signage, gaming, and other embedded applications. DFI Inc. is an associate member of the Intel®Internet of Things Solutions Alliance. From modular components to market-ready systems, Intel and the 350+ global member companies of the Alliance provide scalable, interoperable solutions that accelerate deployment of intelligent devices and end-to-end analytics. Close collaboration with Intel and each other enables Alliance members to innovate with the latest technologies, helping developers deliver first-in-market solutions.

*Intel and Intel Core are registered trademarks of Intel Corporation in the U.S. and other countries.

 

Contact Us

DFI Inc.

10F, No.97, Sec.1, Xintai 5th Rd., Xizhi Dist., New Taipei City 22175, Taiwan (R.O.C.)
+886 (2) 2697 2986  inquiry@dfi.com.tw

 

DFI-ITOX, LLC
15 Corporate Place South, Suite 201, Piscataway, NJ 08854, USA
+1 (732) 390 2815 
www.dfi-itox.com/estore

 

Diamond Flower Information(NL) B.V.
Klompenmakerstraat 89, 3194 DD, Rotterdam Hoogvliet, The Netherlands
+31 (10) 313 4100

 

DFI Co., Ltd.
5F Dai2 Denpa Bldg. 2-14-10 Sotokanda Chiyoda-ku, Tokyo 101-0021, Japan
+81 (3) 5209 1081

 

Yan Ying Hao Trading Co. Ltd. (ShenZhen)
Room 505, 5th Floor, Building D, Hua Chuang Da Central Business Building
Bao'an Road, Bao'an 42th District, ShenZhen, China
+86 (0755) 2372 9390

Full Press Release: Introducing DFI’s Low Power Embedded Boards with Optimized and Thin-Profile Designs

 

 

Cost-Effective Intel® Pentium®/Celeron® Processor N3000-based COM Express Compact for Embedded Systems

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Cost-Effective Intel® Pentium®/Celeron® Processor N3000-based
COM Express Compact for Embedded Systems


DFI, a leading provider offering a wide range of embedded products for industrial applications, introduces its latest COM Express Type 6 module powered by the Intel® Pentium®/Celeron® Processor N3000 Family – BW968. When compared to previous generations, the latest Compact supports 3 independent displays up to 4K x 2K with a lower 4-6W TDP, and it targets cost-effective applications, including entry-level gaming, banking, ticket machine, and digital signage.


3 Independent Displays with High Graphics Performance
With more and more requirements for multiple displays, the Intel® Pentium®/Celeron® Processor-based module is equipped with 3 independent displays (support up to 4K x 2K) to provide stunning graphics performance for superior visual computing in edge devices like gaming machine and digital signage.

 

Fanless & Low Power Design
The mobile-based module featuring ultra-low power (4-6W TDP) design benefits energy efficiency is not only good for the environment, but also saves money. With the energy-saving design, BW968 is well suited for 24/7 operating kiosk such as ticket machine and automated banking machine (ATM). Moreover, the fanless module with DFI’s proprietary design of thin heat spreader can be specially applied in space-limited embedded systems.

 

Enhanced Security & Multiple OSs Support
The BW968 is designed with the optional Intel® Trusted Platform Module (TPM) 2.0, a hardware-based security device that addresses the growing concern on boot process integrity and offers better data protection. Thanks to the TPM 2.0 support, DFI’s BW968 is well suited for gaming and banking application. Not to mention, Linux and all popular Microsoft Windows operating systems are supported, including the latest Windows 10, Window 8.1, Windows 7, WES8, and WES7.


 

 

 


About DFI

Established in 1981, DFI is a leading supplier of high-performance computing technology worldwide. With more than 35 years of experience, DFI focuses on innovative design and manufacture of leading-edge board and system level products for embedded applications requiring strict revision control and long life availability. DFI uses the latest technology platforms and manufacturing techniques to produce cost-effective products for use in medical diagnostic & imaging, ATM/POS, industrial control, kiosk, security & surveillance, digital signage, gaming, and other embedded applications. DFI Inc. is an associate member of the Intel®Internet of Things Solutions Alliance. From modular components to market-ready systems, Intel and the 350+ global member companies of the Alliance provide scalable, interoperable solutions that accelerate deployment of intelligent devices and end-to-end analytics. Close collaboration with Intel and each other enables Alliance members to innovate with the latest technologies, helping developers deliver first-in-market solutions.

*Intel and Intel Core are registered trademarks of Intel Corporation in the U.S. and other countries.

 

Contact Us

 

DFI Inc.

 

10F, No.97, Sec.1, Xintai 5th Rd., Xizhi Dist., New Taipei City 22175, Taiwan (R.O.C.)
+886 (2) 2697 2986  inquiry@dfi.com.tw  
eStore: estore.dfi.com

 

DFI-ITOX, LLC
15 Corporate Place South, Suite 201, Piscataway, NJ 08854, USA
+1 (732) 390 2815 
www.dfi-itox.com/estore

 

Diamond Flower Information(NL) B.V.
Klompenmakerstraat 89, 3194 DD, Rotterdam Hoogvliet, The Netherlands
+31 (10) 313 4100

 

DFI Co., Ltd.
5F Dai2 Denpa Bldg. 2-14-10 Sotokanda Chiyoda-ku, Tokyo 101-0021, Japan
+81 (3) 5209 1081

 

Yan Ying Hao Trading Co. Ltd. (ShenZhen)
Room 505, 5th Floor, Building D, Hua Chuang Da Central Business Building
Bao'an Road, Bao'an 42th District, ShenZhen, China
+86 (0755) 2372 9390

Full Press Release: Cost-Effective Intel® Pentium®/Celeron® Processor N3000-based COM Express Compact for Embedded Systems

 

 

 

DFI EC700 Series System Integrates with IoT Software Solutions

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DFI joined Microsoft Azure Certified for Internet of Things (IoT), offering customers IoT solutions with hardware and software that has been pre-tested and verified to work with Microsoft Azure IoT services. Microsoft Azure IoT is an integrated tool to manage IoT applications which include cloud data storage, security system, and platform services.

The EC700 series is DFI’s latest system for IoT gateway solutions with Microsoft Azure Certification to provide various services for customers. DFI’s EC700 fanless embedded systems come with Intel® Atom™ E3800 processor, which is packed with extensive I/O capabilities. To ensure efficient communication, the EC700 series supports Wi-Fi, 3G/4G, and GPRS applications via mini PCIe slots. In addition, the EC700 series is equipped with SIM card socket and Wi-Fi antenna holes for usage in environments that require wireless connectivity. As for product reliability and availability, the EC700 series is capable of operating under wide range temperature (from -20°C to 60°C) in harsh environments; also, the system can operate against environmental factors with anti-dust and anti-vibration design.

“With Microsoft Azure IoT gateway solutions, EC700 series works efficiently for machine-to-machine (M2M) communication and cloud application integration to achieve business transformation such as industrial automation, transportation systems and monitor facilities,“ said Coolio, Executive Assistant to the COO of DFI. “DFI’s collaboration with Microsoft Azure IoT program will help customers’ IoT solutions to easily implement network connectivity, data acquisition, and information manageability.”
 
About DFI
Established in 1981, DFI is a leading supplier of high-performance computing technology worldwide. With more than 34 years of experience, DFI focuses on innovative design and manufacture of leading-edge board and system products for embedded applications requiring strict revision control and long life availability. DFI uses the latest technology platforms and manufacturing techniques to produce cost-effective products for use in medical diagnostic & imaging, ATM/POS, industrial control, kiosk, security & surveillance, digital signage, gaming, and other embedded applications. As an associate member of the Intel Internet of Things Solutions Alliance, DFI works closely with Intel on development of next-generation standards-based building blocks, platforms, and solutions for the communications and embedded market segments.


Contact Us

DFI Inc.

10F, No.97, Sec.1, Xintai 5th Rd., Xizhi Dist., New Taipei City 22175, Taiwan (R.O.C.)
+886 (2) 2697 2986

 

DFI-ITOX, LLC
15 Corporate Place South, Suite 201, Piscataway, NJ 08854, USA
+1 (732) 390 2815

 

DFI Technologies, LLC
1605 National Drive, Suite 1 Sacramento, CA 95834, USA
+1 (916) 568 1234

 

DFI B.V.
Klompenmakerstraat 89, 3194 DD Rotterdam-Hoogvliet, The Netherlands
+31 (10) 296 1840

 

DFI Co., Ltd.
5F Dai2 Denpa Bldg. 2-14-10 Sotokanda Chiyoda-ku, Tokyo 101-0021, Japan
+81 (3) 5209 1081

 

Yan Ying Hao Trading Co. Ltd. (ShenZhen)
Room 505, 5th Floor, Building D, Hua Chuang Da Central Business Building,
Bao'an Road, Bao'an 42th District, ShenZhen, China
+86 (0755) 2372 9390

Full Press Release: DFI EC700 Series System Integrates with IoT Software Solutions

Providing Windows 10 Compatibility to Make OEM Clients Competitive

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DFI IoT Possibilities
Providing Windows 10 Compatibility to Make OEM Clients Competitive
Internet of Things (IoT) is revolutionizing manufacturing and opening up new revenue opportunities for device OEMs. Being well aware of this mega-trend, DFI, a leader of embedded products for industrial application, has made its products Windows 10 ready to meet IoT demands.

 

In addition to supporting Windows 7 and Window 8.1, the company has added Windows 10 IoT compatibility to its latest board and system level products. Designed to propel IoT advancement, Windows 10 IoT offers a range of features and tools that allow device OEMs to quickly build powerful and connected devices for their customers. By making its products Windows 10 ready, DFI can better assist device OEMs across retail, manufacturing, healthcare, government, and other vertical sectors to develop and deploy IoT solutions.

Three Windows 10 IoT Versions Catering to Different Applications

 

Microsoft released three versions of Windows 10 IoT, each targeting at different user groups and for different application scenarios. These options give device OEMs added flexibility to choose the platform that best addresses their unique requirements. Whereas Windows 10 IoT Enterprise fits automation, digital signage, kiosk, ATM, and medical applications, Windows 10 IoT Mobile Enterprise is optimized for handheld devices, such as mobile point-of-sales units or barcode scanners. Last but not least, Windows 10 IoT Core is meant to target single-purpose, low-power devices such as micro-kiosks or IoT gateways.

Streamline Development Process and Maximize Investments with “One Windows” that Scale Across Devices


Windows 10 enables the creation of Universal Windows apps and drivers that run seamlessly on a broad range of devices –from compact, simple handheld POS units to larger, more sophisticated industrial robots. Moreover, all IoT functions of these devices can be deployed and managed in one development environment, Visual Studio. Since Windows 10 eliminates the redundancy of having to write separate apps and device drivers for every Windows version, developers can streamline development process and direct resources to mission-critical operations.

Empowering the “I” in IoT: Create Device-to-Device and Device-to-Network Connections with AllJoyn Framework and Azure IoT Suite


Windows 10 offers native support for the open-source AllJoyn, a unified protocol that all IoT devices can use to communicate and share functions. Windows 10 is also designed to work with Azure IoT Suite, which is a bundle of cloud based tools and services, to support secure device-to-cloud and cloud-to-device and connections. It makes monitoring, managing, and analyzing data generated from assets within a network much easier. The essence of IoT is “connectedness”; with AllJoyn and Azure IoT Suite, such connectedness on the device-level and network-level is made possible.

Sign-Up Today to Pre-Order Your Samples

 

Four Windows 10 compatible models,SD630, SD631, SD100, HD330, will be available at each DFI global branch office in mid-May for sample pre-order. If you would like to pre-order samples, please click on the "Sign-Up" button below and provide your contact information. Our sales representatives will be in touch with you to arrange the pre-order.

The quantity of samples is limited, and pre-orders are processed on a first come, first serve basis, so sign up today!

 

SD631


 

 

Sign-Up
As IoT is gaining much traction in the marketplace, having an IoT-enabled product portfolio can be a key market differentiator for OEMs. With a host of features, Windows 10 makes an ideal solution for crafting secure and powerful IoT applications and devices. By bringing Windows 10 compatible products on the table, DFI makes its clients more competitive.
DFI Board and System Level Products that Support Windows 10:
Board Level-Intel® Core™/Intel® Xeon®

 

6th Gen Intel® Core™

 

 

Motherboard

 

 

SBC

 

SU551 (3.5)SU251/253 (4”)

 

 

COM Express

 

SH960-QM170/HM170 (Basic)

SU968 (Compact)

 

4th Gen Intel® Core™/4th Gen Intel® Xeon®

Motherboard
HD100-H81
HD330-H81/Q87
HD630-H81
HD631-Q87
HD632-H81
DL310

System Level-Intel® Core™

http://www.dfi.com/Upload/PressHeader/15164/Html/Win10_Compatible_20160427.html4th Gen Intel® Core™

 

EC500-HD/DL Series

Board Level-Intel® Pentium®/Celeron®/Intel® Atom™

Intel® Pentium®/Celeron® Processor N3000

 

Motherboard
BW171/173
BW051

SBC

BW551 (3.5”)

COM Express
BW968 (Compact)

Intel® Atom™ Processor E3800

Motherboard

BT100


SBC

BT253 (4”)

Qseven

BT700


COM Express

BT9A3 (Mini)

System Level-Intel® Atom™

Intel® Atom™ Processor E3800

 

EC200-BT Series
EC700-BT
EC700-BT3054
KS150-BT

About DFI

 

Established in 1981, DFI is a leading supplier of high-performance computing technology worldwide. With more than 35 years of experience, DFI focuses on innovative design and manufacture of leading-edge board and system level products for embedded applications requiring strict revision control and long life availability. DFI uses the latest technology platforms and manufacturing techniques to produce cost-effective products for use in medical diagnostic & imaging, ATM/POS, industrial control, kiosk, security & surveillance, digital signage, gaming, and other embedded applications. DFI Inc. is an associate member of the Intel® Internet of Things Solutions Alliance. From modular components to market-ready systems, Intel and the 350+ global member companies of the Alliance provide scalable, interoperable solutions that accelerate deployment of intelligent devices and end-to-end analytics. Close collaboration with Intel and each other enables Alliance members to innovate with the latest technologies, helping developers deliver first-in-market solutions.

*Intel and Intel Core are registered trademarks of Intel Corporation in the U.S. and other countries.

Contact Us

DFI Inc.

10F, No.97, Sec.1, Xintai 5th Rd., Xizhi Dist., New Taipei City 22175, Taiwan (R.O.C.)
Tel: +886 (2) 2697 2986  E-mail: inquiry@dfi.com.tw  E-Store: estore.dfi.com


DFI-ITOX, LLC
15 Corporate Place South, Suite 201, Piscataway, NJ 08854, USA
+1 (732) 390 2815 E-Store: dfi-itox.com/estore

 

DFI Technologies LLC
1065 National Drive, Suite 1, Sacramento, CA 95834, U.S.A.
+(916) 568-1234

Diamond Flower Information(NL) B.V.
Klompenmakerstraat 89, 3194 DD, Rotterdam Hoogvliet, The Netherlands

+31 (10) 313 4100

DFI Co., Ltd.
5F Dai2 Denpa Bldg. 2-14-10 Sotokanda Chiyoda-ku, Tokyo 101-0021, Japan
+81 (3) 5209 1081

Yan Ying Hao Trading Co. Ltd. (ShenZhen)
Room 505, 5th Floor, Building D, Hua Chuang Da Central Business Building
Bao'an Road, Bao'an 42th District, ShenZhen, China
+86 (0755) 2372 9390

Full Press Release: DFI Provides Win10 Compatibility to Make OEM Clients Competitive

Don’t compromise performance for thinness! The “thin” you should know to empower your business

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Don’t compromise performance for thinness!

The “thin” you should know to empower your business

Thin is in. This is one of the biggest trends in industrial computing applications. DFI, as a leading provider of embedded solutions, is now providing industrial-grade Thin Mini-ITX motherboards that feature the new 6th Generation Intel® CoreTM Processor and Intel® Pentium®/Celeron® Processor N3000 Product Family.

DFI’s Thin Mini-ITX boards are beneficial in space-limited environment due to the rich I/O ports and slim-size. As the equipment had to be a slim footprint to achieve space saving in a narrow occasion, Thin Mini-ITX Boards are becoming the most powerful and thinnest modules in its class on the market today.

Slim Design with Rich I/O Ports and Excellent Thermal Solution Meet Client Expectations

 

In order to fulfill the requirements for application in limited-space environment (such as digital signage, healthcare, surveillance, and power & energy industry) ,DFI dictates that all thin-sized boards must measure less than 25mm with I/O shield, but designed with a multitude of I/O ports. Based on the board space and height limitation, the majority of industrial boards are unable to support rich I/O ports. However, with the DFI qualified board’s lay-out capability, DFI’s thin boards can support three independent displays via HDMI, LVDS, VGA, DVI or DP, and simultaneously support up to 9 USB 3.0/2.0 ports, 4 COM ports, and rich expansion slots. Having that said, DFI is aiming to build a powerful thin board that can help users operate facilities in a more flexible way. Low maintenance and high level of robustness without vulnerable fans are becoming essential to pursuit year-long reliable usage. Under the high performance of CPU, our Thin Mini-ITX Motherboards come with new proprietary heat spreader technology to reduce the height of the board, and it also further support thin boards to be more flexible in a variety of applications, including low noise-level and narrow conditions. With brilliant Thermal solutions built right into Thin Mini-ITX Board, we successfully exclude superheated operating and fulfill diversity of needs.

Diversity platforms across our Thin Mini-ITX boards brings out Dominance


In mainstream healthcare, gaming, digital signage, retail, and transportation, different environment request distinctive performance and efficiency. DFI’s Thin Mini-ITX boards are embedded with versatile Intel platforms that bring scalable performance from entry-level to premiere-level. We devoted considerable effort in fulfilling multiple kinds of demands. To further meet the demanding needs of high graphics and performance, we leverage the performance not only on the processor side through core evolution, but also feature Intel HD graphics that bringing eye-catching graphics to thinner and lighter boards. Meanwhile, the Thin Mini-ITX boards combined with the low power consumption of advanced processor can support long battery life, which is integral in delivering high-value and high efficiency. From digital signage and gaming kiosks to facilities in retail, transportation, and factory settings, the offer of longevity and high-end graphics makes our Thin Boards well-suited for a wide range of applications.

DFI optimized Thin Mini-ITX solutions to offer partners an outstanding quality boards


Since the medical equipment is used in cramped input terminals or narrow bed-side workstations (such as clinic information systems, patient data management systems, radiology information systems, picture archiving and communication systems) they seek slimmer devices to build more commodious space. Apart from the slim form factor, the high-efficiency and high-graphics were requirements needed to deliver advanced performances for applications in operating rooms, surgical intervention rooms, and recovery rooms. Due to those requirements, our thin Mini-ITX is the most suitable choice for applications that need thin-sized board, high performance, and rich I/O ports. With rich I/O ports, we can strongly support a healthcare device that is connected to more than one operating panels, leading to flexible space utilization.

 

To achieve the goal of delivering premium quality products to partners and consumers while meeting their demands, DFI is continuously innovating and making all efforts to develop first-class thin Mini-ITX boards.

                                 SD101/103
                                    SU171/173
                                                                   BW171/173
HU101/103
HU171/173
BT101/103
BT160
BT161
KB160
KB161

Contact Us

DFI Inc.

10F, No.97, Sec.1, Xintai 5th Rd., Xizhi Dist., New Taipei City 22175, Taiwan (R.O.C.)
Tel: +886 (2) 2697 2986   E-mail: inquiry@dfi.com.tw   E-Store: estore.dfi.com


DFI-ITOX, LLC
15 Corporate Place South, Suite 201, Piscataway, NJ 08854, USA
+1 (732) 390 2815

 

DFI Technologies LLC
1065 National Drive, Suite 1, Sacramento, CA 95834, U.S.A.
+(916) 568-1234

Diamond Flower Information(NL) B.V.
Klompenmakerstraat 89, 3194 DD, Rotterdam Hoogvliet, The Netherlands

+31 (10) 313 4100

DFI Co., Ltd.
5F Dai2 Denpa Bldg. 2-14-10 Sotokanda Chiyoda-ku, Tokyo 101-0021, Japan
+81 (3) 5209 1081

Yan Ying Hao Trading Co. Ltd. (ShenZhen)
Room 505, 5th Floor, Building D, Hua Chuang Da Central Business Building
Bao'an Road, Bao'an 42th District, ShenZhen, China
+86 (0755) 2372 9390

Full Press Release: Thin Mini-ITX Solution with fewer I/O ports and lower performance? Wrong! DFI makes an aggressive breakthrough!

Small and Lightweight, but Powerful! Why Not? Fanless Embedded Box PCs Boost Performance in Industrial Machines

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Small and Lightweight, but Powerful! Why Not?
Fanless Embedded Box PCs Boost Performance in Industrial Machines

DFI (a leading provider offering a wide range of embedded products for industrial applications) has been dedicated to developing trusted and rugged industrial box PCs to collect and process data generated by numerous connected machines. Which poses a real challenge for today’s system integrators and application developers.

 

DFI’s fanless and compact embedded box PCs are designed with industrial-strength components and soldered-down CPU and memory in order to bring enhanced reliability and stability in harsh operating environment. In addition, leveraging DFI's proprietary heat dissipation technology, the IPCs adopted fanless design not only allows the systems to perform in extreme temperature conditions, but also reduces active components for longer product lifecycle and simpler maintenance. Since there are a few challenges (such as extreme temperature, dust, and power supply limitation that can create issues for industrial equipment) the mechanical design of embedded PCs must be durable and robust under such demanding conditions on the shop floor. Also, due to the fact that most space in equipment is occupied by machine elements, the installation for box PCs is restricted to a very limited area. DFI’s versatile compact fanless industrial PCs provide outstanding processing capability and power efficiency in an ultra-small size to integrate with production machines and proactively optimize the factories operations.

 

“DFI’s fanless, lightweight, and compact box PCs product portfolio is targeted for a large variety of industrial control applications and deploys exceptional scalability by featuring entry-level (low-power Intel® Atom™ processor) to high-end platforms (6th Gen Intel® Core™ processor) to consolidate and engage in embedded solutions with a variety of requirements.” said GS Liu, DFI’s system product planning leader. “When designing this series, we combined many factors such as wide power input for plant uses, extended temperature support for critical systems, wireless connectivity that offers seamless valuable data transition, and substantial I/O ports with high flexibility to ensure that the box PCs would meet and exceed industry standards for ruggedness and reliability while still delivering the performance that our customers expect.”

Thanks to these brilliant features, the small but powerful IPCs can help customers optimize their equipment performances and strengthen reliability and responsiveness to an array of smart solutions, such as smart factory, digital healthcare, and IoT gateways.

High-Performance: EC70A-SU

 

As a flawless combination of impressive stylish design and excellent computing capability, EC70A-SU brings a whole new concept to the IPC market. Based on the high-end 6th Gen Intel® Core™ i7/i5/i3 processors, it delivers outstanding processing capability in a fanless and compact enclosure. And it is designed for space-limited and compute-intensive solutions like smart factory, digital healthcare, and surveillance.

Deeply-Embedded: EC700-BT

 

The EC700-BT takes full advantage of the Intel® Atom™ E3800 processor, which is packed with extensive I/O capabilities and extended operating temperatures to provide advanced endurance and high scalability. Making the box PC ideal for harsh environments such as industrial automation and transportation.

Entry-Level: EC800-CD

 

DFI’s palm-sized and ultra-compact embedded box PC, EC800-CD, is powered by low-power and energy-efficient Intel® Atom™ processor N2000/D2000 series. To ensure productive communication, the system supports Wi-Fi and 3G via optional modules for embedded applications that require wireless and mobility including retails and IoT networks.

DFI’s EC70A-SU, available this fall, is the world’s smallest fanless and lightweight embedded box PC based on 6th Generation Intel Core processors. Featuring significantly improved performance and all-new rugged ID design to offer system providers a perfect choice to their embedded solutions.


Want More Information?
Just leave your name and email below, and you’ll be the first to learn about special events, sample availability and latest information about EC70A-SU.

 

Get More Info ›

About DFI

Established in 1981, DFI is a leading supplier of high-performance computing technology worldwide. With more than 35 years of experience, DFI focuses on innovative design and manufacture of leading-edge board and system level products for embedded applications requiring strict revision control and long life availability. DFI uses the latest technology platforms and manufacturing techniques to produce cost-effective products for use in medical diagnostic & imaging, ATM/POS, industrial control, kiosk, security & surveillance, digital signage, gaming, and other embedded applications. DFI Inc. is an associate member of the Intel® Internet of Things Solutions Alliance. From modular components to market-ready systems, Intel and the 350+ global member companies of the Alliance provide scalable, interoperable solutions that accelerate deployment of intelligent devices and end-to-end analytics. Close collaboration with Intel and each other enables Alliance members to innovate with the latest technologies, helping developers deliver first-in-market solutions.


*Intel and Intel Core are registered trademarks of Intel Corporation in the U.S. and other countries.

Contact Us

DFI Inc.

10F, No.97, Sec.1, Xintai 5th Rd., Xizhi Dist., New Taipei City 22175, Taiwan (R.O.C.)
Tel: +886 (2) 2697 2986   E-mail: inquiry@dfi.com   E-Store: estore.dfi.com


DFI-ITOX, LLC
15 Corporate Place South, Suite 201, Piscataway, NJ 08854, USA
+1 (732) 390 2815

 

DFI Technologies LLC
1065 National Drive, Suite 1, Sacramento, CA 95834, U.S.A.
+(916) 568-1234

Diamond Flower Information(NL) B.V.
Klompenmakerstraat 89, 3194 DD, Rotterdam Hoogvliet, The Netherlands

+31 (10) 313 4100

DFI Co., Ltd.
5F Dai2 Denpa Bldg. 2-14-10 Sotokanda Chiyoda-ku, Tokyo 101-0021, Japan
+81 (3) 5209 1081

Yan Ying Hao Trading Co. Ltd. (ShenZhen)
Room 505, 5th Floor, Building D, Hua Chuang Da Central Business Building
Bao'an Road, Bao'an 42th District, ShenZhen, China
+86 (0755) 2372 9390

Full Press Release: Fanless Embedded Box PCs Boost Performance in Industrial Machines


解析友通的利器 全方位设计灵活多元应用的薄型主机板

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解析友通的利器

全方位设计灵活多元应用的薄型主机板

薄型-在工业市场上成为业者争先恐后开发的一种趋势。具备高度竞争力的友通资讯推出搭载第六代英特尔处理器的薄型主机板,抢攻市场商机。

在空间狭小的环境限制下,薄型主机板成为市场主流产品。友通新一代薄型主机板搭载高效能处理器并拥有丰富的连接,使客户能在满足生产效率的同时,也能灵活地进行空间运用。

充足端口的薄型设计与完美散热解决方案满足客户的需求

 

友通资讯为了满足数位看板、医疗、监控系统以及能源等嵌入式产业,在有限空间下的应用需求,致力研发厚度小于25毫米的新型Mini-ITX工业级主机板且同时具有丰富的连接埠。友通新一代主板可同时支持3个独立显示接口、高达9个USB连接孔、4个COM和足够的扩充插槽。在此优势下,友通薄型Mini-ITX能协助客户更有效率地在区域狭窄的空间下发展出高效能的整机系统。友通以独特的散热技术开拓薄型无风扇设计主板的崭新面貌,透过此技术,降低主板高度与避免过热的运作状态在拥有高效能的同时,达到最佳散热效能。综合以上优点,优异的散热解决技术以及完美的薄型设计,将可满足更广泛的应用需求

多样化的平台满足客户各式嵌入式方案


在智慧医疗、博奕、数字看板、零售及运输产业中,不同领域使用者对于产品的效能要求往往有所不同。友通推出的薄型Mini-ITX主板搭配多元系统平台,涵盖从入门至高阶款的效能选择,可满足不同的使用者需求。不仅具备优良的资料运算能力,也同时搭载整合高效能的英特尔HD显示晶片,提升图像品质,并带来高解析度的媒体视觉体验。与此同时,搭载低功耗省电的高阶英特尔酷睿处理器,杰出的图像处理能力加上高达7年的产品生命周期,让友通新一代嵌入式产品更加契合客户的多元化应用方案。

高质量薄型主板为我们商业伙伴延伸更多效益


医疗器材业者面对设备需要放置在狭窄空间的限制(如临床资讯系统、病患资讯管理系统和医疗影像存档及通讯系统),嵌入的主机板在有限的机箱空间下,同时具备高效率与高图像品质的支援处理成为进阶医疗应用的必备条件。鉴于以上需求,友通资讯的薄型主板是这类型业者的不二选择;不但解决空间限制的问题,同时兼具高效能运作、高影像品质处理、无风扇低维修成本与充足的连接埠,这些优势充分满足医疗环境的应用需求,为我们的商业伙伴产生更多的效益。

 

未来友通资讯也将藉由不断创新并持续研发高质量的嵌入式产品,帮助蓬勃发展的智能产业一臂之力。

                                 SD101/103
                                    SU171/173
                                                                   BW171/173
HU101/103
HU171/173
BT101/103
BT160
BT161
KB160
KB161

联系我们

台湾总公司
友通资讯股份有限公司
22175 新北市汐止区新台五路一段97号10楼
+886 (2) 2697 2986   inquiry@dfi.com.tw   estore.dfi.com

深圳衍英豪商贸有限公司
中国广东省深圳市宝安区42区宝安大道华创达中心商务大厦D栋5楼505
+86 (0755) 2372-9390

完整新闻稿: 解析友通的利器 - 全方位设计灵活多元应用的薄型主机板

Intel Edison or Onion Omega2?

Offline Data Sheet Access

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My name is Payton and I'm with the Georgia Tech Research Institute (GTRI) and I work in the Cyber Technology Information Security Laboratory (CTISL).  We have various networks set up for our engineers that do not have internet access and we need those engineers to be able to access various electronic component datasheets.  Is there any way to obtain copies of Intel's datasheets so we can upload them onto said networks?

 

Thank you for your help,

 

Payton 

loading of embedded OS on die (boolean logic silicon gated transistors)

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I am affiliated with a company that has been studying possible backdoor technologies embedded in some CPU. We believe that the backdoor system is made of a special backdoor CPU and an embedded backdoor OS. The question is simply how probable is that we could somehow code the right instruction(s) to command the backdoor CPU to load embedded OS which is stored on die by way of boolean logic silicon gated transistors and not ROM and not EEPROM and not flash memory ? We know absolutely nothing of the likely custom instruction set of the backdoor CPU.

Wind River Unveils Latest Version of IoT Device Management Platform

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HDC blog pic 1.png

Wind River Unveils Latest Version of IoT Device Management Platform

By Santhosh Nair

 

We are very pleased to introduce the latest version of Wind River® Helix™ Device Cloud, which further solidifies Wind River and Intel® leadership in the Internet of Things (IoT).

 

The latest release of Device Cloud is a result dedication, collaboration and innovation across multiple organizations within the Intel family, including Wind River, Intel Security Group, and Intel Services Division. This multi-disciplinary team brought together a unique set of skills necessary to solve the tough challenges associated with IoT device management. The result is a differentiated product that is uniquely positioned in the increasingly competitive IoT market.

 

Device Cloud solves the problem of connecting and managing devices remotely. It collects data from hundreds or thousands of disparate devices, machines, and systems, enabling your operators to track device status and content, share data among engineers, and proactively determine when updates are needed.

 

HDC blog pic 2.png

 

This update includes significant changes from edge-to-cloud. A new user interface helps operators monitor and interact with remote devices. Improved agent functionality increases security and offers portability to multiple operating systems. The cloud platform provides elastic scalability to grow along with device deployments and fault tolerance to provide maximum availability. Event forwarding and a comprehensive set of REST APIs expose device management data and commands for integration with other business systems and cloud applications.

 

HDC blog pic 3.png

 

With the proliferation of connected devices in the IoT, the ability to deploy, monitor, manage, service, update, and decommission those devices becomes vital. The technology capabilities in Device Cloud can be applied to a wide range of use cases, such as the following:

  • Gateway management by providing the tools to monitor, diagnose, service, and update gateways deployed in the field – significantly reducing operating costs.
  • Proactive maintenance by collecting machine data so that decisions can be made based on the condition of equipment in the field and technicians alerted when a problem needs to be addressed for maintenance.
  • Industrial automation by enabling companies to connect with legacy equipment and feed information and alerts to a central monitoring team.
  • Transportation by allowing transportation operators to measure driving behaviors and driver performance, monitor vehicle usage and fuel efficiency, and realize new efficiencies in routing, maintenance, and staffing.
  • Medical equipment by enabling medical equipment to be monitored, diagnosed, and updated remotely, while also providing real-time feedback on usage and consumables metering.

 

The IoT vision is quickly becoming reality, as more and more enterprises seek to unlock the value of the data generated by their everyday operations. Utilizing Device Cloud, device manufacturers and IoT solution providers can accelerate device deployment and close a critical gap in IoT operations: ensuring that the devices enterprises depend on are performing as expected.

 

To learn more about Device Cloud, visit: http://www.windriver.com/announces/helix-cloud/device-cloud/

Wind River will be showcasing Device Cloud this week at Intel Developer Forum.

 

For additional information from Wind River, visit us on LinkedIn.

Roving Reporter: Pumping Up NVR Performance for Full HD and UHD

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As one of the many industries growing rapidly as part of the Internet of Things (IoT), video surveillance is a hot market for developers and system integrators. According to Transparency Mark Research, by 2019 the video surveillance market will experience a compound annual growth rate (CAGR) of more than 19 percent, reaching more than $42 billion.

 

Growing installations of IP cameras and the need for surveillance cameras with better video quality – especially Full HD (1080p) and 4k UHD – are driving global demand for IP-based video surveillance systems (Figure 1). Equally important, cameras featuring H.265 technology are enabling higher-quality images in smaller file sizes, helping reduce demand on network bandwidth and on-premise storage.

 

intel image.png

Figure 1. Demand for Full HD (1080p) and 4k UHD is driving increased global demand for IP-based video surveillance systems.

 

For any company looking to take part in the video surveillance market’s rapid growth, one important component in a single- and multiple-location DSS systems is the network video recorder (NVR). This essential processing and storage equipment enables fog computing capabilities such as:

 

  • On-premise processing and storage of surveillance video
  • Transcoding video for viewing on devices ranging from workstations to smart phones
  • Performing video content analysis to automate incident identification and forward only video of value (evidence or business insight) to the cloud or data center

 

In this post, we look at both a ready-to-go NVR system and a COM Express board that provides a flexible, high-performance solution for NVR design. Both enable top-of-the-line performance without the added cost of a discrete graphics adapter through their use of the latest Intel® Core™ and Xeon® processors with integrated Intel® HD Graphics.

 

Ready-to-Stream NVR#_msocom_1

IoNetworks is a Taiwan company that specializes in IP surveillance solutions as well as other network solutions. Their IOR-4660-C20 supports up to 128 IP video cameras and is a good example of their state-of-the-art in NVRs (Figure 2).

 

ionetworks.JPG

Figure 2. The IOR-4660-C20 with support for up to 128 IP video cameras is a good example of an advanced ioNetworks NVR.

 

This rackmount 2U NVR is designed for single-site and multiple-building installations in public and private facilities, such as critical infrastructure, corporate buildings, airports, and retail stores. For local security staff, the unit can provide independent video feeds to up three displays (2x HDMI, 1x DVI-I).

 

For storage, the IOR-4660 offers 1x 2.5” SDD/HDD, plus 8x 3.5” hot swappable HDDs. RAID support includes 0, 1, 5, 6, 10, 50, 60. A 3U design supports up to 16x hot swappable HDDs.

 

To handle memory needs in processing video streams, the IOR-4660 features up to 64GB of DDR4 DRAM. Dual Intel® Gigabit Ethernet handles network connections. And for expansion, the unit offers 1x PCI Express (PCIe) 3.0   x16 slot, 1x PCIe 3.0/2.0 x4, 1x PCIe 3.0/2.0 x1, and 1x PCI slot. USB ports include 10x USB 3.0. For audio, the unit feature line-in, line-out, and mic-in.

 

COM Express Board for NVR Designs

If designing an NVR, one smart approach is to use a server-on-module (SoM). Congatec’s conga-TS170 COM Express board is a perfect example (Figure 3). SoMs provide great design flexibility. When performance demands increase, designers can upgrade NVR systems rapidly by inserting a more powerful SoM. Likewise, SoMs offer a great level of flexibility in fulfilling individual size and ruggedness demands.

 

conga-TS170.jpg

Figure 3. The congatec conga-TS170 is a perfect example of a server-on-module ideal for NVR use.

 

Congatec’s SoMs comply with the PICMG’s COM Express Basic, enabling designers to profit from maximum design security. They also come with extensive ecosystem support, including Board Support Packages, comprehensive driver support, and instantly application-ready carrier boards and evaluation kits.

 

The conga TS170 offers the common I/O interfaces of the Type 6 pinout: PCI Express Graphics Gen 3.0, 8x PCI Express Gen 3.0 Lanes, 4x SATA 3.0 including RAID 0, 1, 5, and 10 support, 4x USB 3.0, 8x USB 2.0, LPC and I²C. Microsoft Windows 10 and all other current Microsoft Windows and Linux operating systems are supported. Individual integration support, an extensive range of accessories, as well as optional Embedded Design & Manufacturing Services for individual carrier board and system designs complete the package.

 

Powerful Processor Graphics

The conga-TS170 COM Express modules offer a range of 6th generation Intel® Core™ processors and Intel® Xeon® processors, including the recently launched Intel® Xeon® processors E3-1578L v5 and E3-1558L v5with Intel® Iris™ Pro Graphics P580 and P55-respectively.  Accelerated by 128 MB of fast internal eDRAM, these new SKUs double the graphics and media processing units’ base frequency (to up to 700 MHz) compared to previous Intel Core processors (Figure 4).

 

iris graphcs.JPG

Figure 4. Intel® Iris™ Pro Graphics deliver outstanding graphics and media processing performance.

 

This boost significantly speeds up performance by enabling the hardware accelerators – among the features important for video transcoding – to always operate at this new higher basic clock rate. The processors enable processing up to two 4k HEVC output streams or up to 15 Full HD-HEVC streams in real-time. Such performance can be critical to surveillance systems using video analytics and needing to quickly transmit clips to staff of potential incidents. These incidents could be anything from someone loitering in a parking lot, putting merchandise in a purse or bag, or abandoning a bag in an airport or other transportation terminal.

 

Intel Iris Pro Graphics is an integrated professional graphics unit. It features additional execution units (EUs). Its advanced video engine decodes H.265/HEVC completely in hardware and thereby much more efficiently than before. The processors provide an excellent solution for installations using this new video format. In addition, Intel Iris Pro Graphics deliver crisper images with more vibrant colors.

 

Similar to the conga-170’s other processor options, the ioNetworks IOR-4660 offers a selection of 6th generation Intel® Core™ i5/i7 processors with integrated Intel® HD Graphics 530. SKUs of the 6th generation Intel Core i5/i7 processor product family with these graphics introduce a special fixed-function mode (FF-Mode) for Intel Quick Sync Video. Optimized for real-time H.264 and H.265, this new mode lowers latency and reduces power consumption when handling multiple video streams. These 6th generation Intel Core processors also include accelerated 4K hardware media codecs that enhance high-density streaming applications like video surveillance.

 

DSS Systems and Boards Designed to Deliver Performance

These two NVR solutions are just a few of the many DSS systems and components offered by members of the Intel® Internet of Things Solutions Alliance. To see more ways you can pump up NVR performance for full HD and UHD, see the Alliance’s Solutions Directory.

 

Learn More

Contact featured members:

 

Solutions in this blog:

 

Related topics:

Congatec is an Associate member of the Intel® Internet of Things Solutions Alliance. IoNetworks is a General member of the Alliance.

 

Mark Scantlebury

Roving Reporter (Intel Contractor), Intel® Internet of Things Solutions Alliance

Editor-in-Chief,Embedded Innovator magazine


Roving Reporter: Ringing Up POS System Sales with Intel® vPro™ Technology

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The market for point-of-sale (POS) machines is extremely competitive, but POS machine designers can get an edge by appealing to two top retailer concerns: security and maintenance costs. Solve these problems for retailers and they are likely to line up to buy your money-saving solution.

 

How big of a problem are these two issues? According to Global IT service provider CompuCom, an IT visit can cost USD $187. A remote repair, on the other hand, costs just USD $12 – that’s 90 percent less expensive.

 

What about security? According to the Verizon 2015 Data Breach Investigations Report, the location of 70 percent of retail security breaches is the point of sale. This one remarkable fact shows just how vulnerable legacy POS machines are to identity thieves.

 

The first step to solving these issues for retailers is basing POS solutions on Intel®  vPro™ platforms. Platform choices include the Intel® Core™ i5/i7 vPro™ processor family and the Intel® Xeon® processor E5-1600, E3-1500, and E3-1200 product families, as well as numerous Intel® chipsets and network adapters.

 

In cases where retailers are already using POS machines with these components, IT managers and managed service providers can activate the Intel vPro features in them. Intel® Setup and Configuration Software 9.0 makes implementing Intel vPro processor-based devices simple and fast. In a matter of minutes, many of the security and manageability features described here can be available.

 

Reducing Maintenance Costs

Intel® vPro™ technology and its remote device management component, Intel® Active Management Technology (Intel® AMT), easily and inexpensively integrate with existing IT environments and management infrastructure. Once activated, Intel vPro technology and Intel AMT work together to support the following management capabilities:

 

  • Real-time access and full remote control over POS devices with integrated Keyboard-Video-Mouse (KVM) capabilities – even when operating systems or disk drives fail and the device won’t boot (Figure 1)
  • Direct remote boots into the BIOS (via KVM support)
  • Highly secure remote resets of forgotten disk encryption passphrases or PINs
  • Remote system reimages and rebuilds
  • Preboot eXecution Environment (PXE) support to boot devices remotely using their PXE-capable network interface controller (NIC)
  • Remote shutdown and power-on to reduce energy consumption
  • Provision of a temporary POS device to enable users to continue working while a device is repaired or reimaged

 

KVM use case.JPG

Figure 1. Intel® Active Management Technology (Intel® AMT) enables real-time access and full remote control over POS devices with integrated Keyboard-Video-Mouse (KVM) capabilities – even when operating systems or disk drives fail and the device won’t boot.

 

Improving Security at the Point of Sale

Any compromise of data generated at a retail POS is unacceptable – yet many retailers still rely on software-based authentication such as username and password. More than 50 percent of data breaches are caused by misused or stolen user credentials.

 

A retailer’s reputation can be lost right along with any customer identity information in a fraction of a second. Intel vPro technology helps protect against threats from hackers and identity thieves through exceptional, hardware-based security features. Its security takes a multilayered approach:

 

  • Protection through hardware-based security access featuring the multifactor authentication of Intel® Authenticate Technology. In addition, Remote Secure Erase and Intel® Enterprise Digital Fence provide excellent data protection for Intel® Solid State Drives.
  • Detection through security features such as BIOS Guard and OS Guard offering hardware-based device and platform protection against BIOS and malware attacks.
  • Correction through remote out-of-band patching and recovery.

 

Use Case Examples

Intel vPro technology solutions are helping retail operations all over the world save on maintenance. The Bank of New Zealand, for instance, uses Intel vPro technology for their ATMs to power up devices for delivering patches, distributing software updates, and enforcing security policies. When an ATM experiences a system crash, the bank avoids a costly truck roll by running diagnostics and remediating issues via a remote hardware-based KVM session.

 

METRO Cash & Carry, an international leader in self-service wholesale, uses Intel vPro technology to remotely update POS machines even if a location is closed and machines are switched off (Figure 2). According to internal tests, METRO is saving the equivalent of several IT workdays per month by employing the remote manageability features offered by Intel Core vPro processors.

 

direct power control.JPG

Figure 2. Intel® vPro™ technology enables remotely updating POS machines even if a location is closed and machines are switched off.

 

Architectural Considerations

Intel vPro technology platforms include features and capabilities to tightly integrate with complex infrastructure components such as Microsoft Active Directory*, DNS, DHCP, public key infrastructure (PKI), enterprise WLAN environments, and standard toolsets such as Microsoft System Center Configuration Manager and McAfee ePO Deep Command*. These infrastructure components are optional and depend upon IT requirements around security and investment in existing systems management products.

 

At the highest level, the recommended and most secure version of the solution architecture is comprised of the components shown in Figure 3 and Figure 4.

 

vpro architecture.JPG

Figure 3. This diagram shows how to use Intel® vPro™ technology in a retail enterprise environment for the best results in terms of security and manageability.

 

Intel vpro platform.JPG

Figure 4. This is a close-up of the Intel® vPro™ technology portion of Figure 3.

 

Putting Intel® vPro Technology on the Sales Floor

For over a decade now Intel has continuously improved the feature set of Intel vPro technology and the performance, stability, and reliability of Intel AMT. POS machine designers can choose from a wider variety than ever of embedded boards and POS systems offering Intel vPro technology, including new boards and systems featuring the latest 6th generation Intel® Core™ i5/i7 vPro processors. With advances in performance, productivity, data security, and identity protection, these processors provide Intel’s best solution yet for retail POS.

 

To provide a sample of what’s available from members of the Intel® Internet of Things Solutions Alliance, we chose a selection based on the mini-ITX form factor. Mini-ITX is a good choice because components are on a single board, all I/O is defined and integrated on the board in a standard manner with standard commercial connections, and the boards are competitively priced.

 

 

Product

  1. Intel® vPro  Processors

 

Form Factor

 

Features

Avalue EMX-Q170

  1. 6th generation Intel® Core i7/i5 processor product family

Mini-ITX

  • 2x 260-pin DDR4 2133MHz SO-DIMM socket, supports up to 32GB
  • 1x Intel® I219LM PCIe Gigabit Ethernet PHY
  • 1x Intel® I211AT PCIe Gigabit Ethernet
  • Realtek ALC892 HD Audio Codec
  • VGA, HDMI, DisplayPort, dual channel 18/24-bits LVDS (Chrontel CH7511B eDP to LVDS)
  • 5x SATA III, 1 x SATA III or 1 x mSATA III switch by Jumper
  • 1x PCIe x16
  • 1x full-size mPCIe with mSATA Support (SATA III)
  • 1x half-size mPCIe
  • 6x USB 2.0 by pin header
  • 4x USB 3.0 at I/O
  • 1x PS2 keyboard/PS2 mouse with dual deck USB 2.0
  • 5x RS232, 1x RS232/422/485
  • Line-in, Mic-in, Line-out
  • 8-bits GPIO
  • Onboard Infineon SLB9665 support TPM 2.0
  • ATX Power

Ennoconn NSB-3011

Intel® Xeon® processors E3-1275 v5, E3-1268L v5, E5-1225 v5

Mini-ITX

  • 3x displays (VGA, DisplayPort, HDMI)
  • DDR4 support (ECC memory support)
  • COM1 for RS-232/422/485 selectable
  • 2x GbE
  • SATA III
  • USB 3,0
  • PCIe x16
  • COM
  • Audio

Fujitsu D3433-S

i7-6700

i7-6700TE

i5-6500

i5-6500TE

Mini-ITX

  • Designed for 24-hour operation
  • DDR4 2133 SO-DIMM up to 32GB
  • 2x DisplayPort 1.2, 1x DVI-D, 1x eDP, 1x LVDS dual channel 24-bit
  • PCIe Gen3 and mPCIe
  • 4x SATA III
  • RAID
  • mSATA & M.2 socket
  • 2x GbE
  • Dual power option (ATX/12V DC-in)
  • TPM 2.0
  • 2x serial ports
  • 1x DVI
  • 4x USB 3.0, 4x USB 2.0
  • Audio

iBASE MI990

i7-6822EQ

i7-6820EQ

i5-6442EQ

i5-6440EQ

Mini-ITX

  • 2x DDR4 SO-DIMM slots for up to 32GB of memory
  • 6x USB 3.0, 4x USB 2.0
  • 6x COM
  • 4x SATA III
  • RAID
  • DVI-D, HDMI, DisplayPort, and 24-bit dual channel LVDS
  • PCIe x16, PCIe x8, PCIe x4, PCIe x1, mPCIe, and 3x PCI slots
  • 2x GbE
  • 1x PCIe x16, 2x mPCIe, 1x M.2
  • TPM 2.0
  • iSMART 3.0
  • Digital I/O (4-in/4-out)
  • Audio
  • Watchdog timer

IEI KINO-AQ170

6th generation Intel® Core i7/i5 processor product family

Mini-ITX

  • 2x SO-DIMM DDR4-2133 up to 32 GB
  • 3x display (HDMI 2.0/HDMI/Display Port/VGA/iDP)
  • 2x GbE
  • SATA 6Gb/s
  • mSATA
  • USB 3.0
  • 8-bit digital I/O (2x 5pin)
  • 1x SMBus
  • Audio
  • Watchdog timer

Jetway JNF594-Q170

6th generation Intel® Core i7/i5 processor product family

Mini-ITX

  • 2x SO-DIMM DDR4-2133 up to 32 GB
  • 3x display (HDMI, DisplayPort, DVI-D)
  • 4x SATA III
  • RAID
  • mSATA/mPCIe shared slot
  • 1x PCIe 3.0 x16, 1x mPCIe
  • 2x GbE
  • Audio
  • 6x USB 3.0, 2x USB 2.0
  • 4x serial (2x RS232, 2x RS232/422/485)
  • CE, FCC, ROHS, REACH, EuP/ErP

MSI MS-98B2

I76600U

Mini-ITX

  • Low power consumption solution
  • 2x SO-DIMM DDR4-2133 up to 32 GB
  • 2x display (HDMI, DisplayPort)
  • 2x GbE
  • 4x USB 3.0, 8x USB 2.0
  • 2x SATA III
  • 4x COM (COM 1 RS-232/422/485; COM 2-4 RS-232)
  • mSATA/mPCIe shared slot
  • Audio
  • Watchdog Timer
  • FCC, CE, C-Tick, VCCI, BSMI

Portwell WADE-8017

6th generation Intel® Core i7/i5 processor product family

Mini-ITX

  • 2x SO-DIMM DDR4-2133/1866 up to 32 GB (ECC option)
  • 3x display (HDMI, DisplayPort, VGA)
  • 2x GbE
  • 1x PCIe x16
  • 1x mPCIe or mSATA
  • 1x M.2
  • Audio (line-in, line-out, mic-in)
  • Serial (1x RS-232/422/485; 1x RS-232; 4x RS-232 on pin header)
  • 4x USB 3.0, 2x USB 2.0
  • TPM 1.2 (optional)
  • MTBF over 120,000 hours at 40° C

 

Give Your POS Solutions the Intel® vPro™ Technology Advantage

Boost your sales by differentiating your POS systems using the manageability and security features that come by starting with a board offering Intel vPro technology. For a complete list of the hundreds of embedded systems and boards targeting the retail market and offering Intel vPro technology, see the Alliance’s Solutions Directory.

 

Learn More

Solutions in this blog:

 

Related topics:

Avalue, Ennoconn, Fujitsu, iBASE, IEI, and Portwell are Associate members of the Intel® Internet of Things Solutions Alliance. Micro Star International (MSI) is an Affiliate member. Jetway is a General member.

 

Mark Scantlebury

Roving Reporter (Intel Contractor), Intel® Internet of Things Solutions Alliance

Editor-in-Chief,Embedded Innovator magazine


Roving Reporter: A Probe-based Service Assurance Solution for Accelerating NFV Migration

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Network function virtualization (NFV) is radically changing the communications deployment model. Traditional deployments take a waterfall approach, investing first in network deployment, then in network management systems and service fulfillment, and finally in service assurance and customer experience management. NFV and software-defined networking (SDN) turn this model around, taking a top-down approach by molding the network to service requirements.

 

The new model requires service orchestration – in conjunction with various network management and orchestration elements – to automate the steps required to build and provision end-to-end service. By making service assurance monitoring and customer experience management an integral part of this service orchestration, service providers can deliver right-sized solutions from the start. They can also identify when to scale with new virtual elements to ensure high network performance and quality of experience.

 

The missing components in this transition to NFV are probe solutions that can address hybrid environments encompassing both virtual and physical networks. Such a hybrid world requires probes that deliver true end-to-end network visibility (Figure 1).

hybrid.bmp

Figure 1. Hybrid networks with NFV elements require a virtual probe (vProbe) solution to deliver true end-to-end network visibility.

 

Taps or splitters, for instance, cannot monitor logical interfaces that use internal virtual machine-to-virtual machine (VM-to-VM) communication between functions hosted on the same server. Monitoring such virtual network elements requires a virtual probe (vProbe) function that monitors all traffic in the virtualization platform – both external traffic on the virtualization platform’s physical interfaces, as well as VM-to-VM communications.

 

One of the first vendors to launch such a vProbe for NFV is RADCOM. In 2014, the company introduced its MaveriQ service assurance and customer experience management solution. With probes that support both legacy network traffic and virtual traffic in its product portfolio, the company serves as a comprehensive probe provider for hybrid networks.

 

NFV-ready, the MaveriQ solution helps service providers handle today’s massive traffic explosion. The solution is composed of three elements:

 

  • MaveriQ vProbes deploy in an NFV network as a Virtual Network Function (VNF) or in a legacy network with the same software running on commercial-off-the-shelf (COTS) hardware. No matter how deployed, they provide the same functionality and can be mixed in the same network under a single MaveriQ management system. These vProbes scrutinize multiple services such as mobile data, voice, SMS, and video that run over a wide range of technologies including LTE, VoLTE, UMTS, GPRS, and IMS, all in one box (or as a VNF).
  • The MaveriQ Service Assurance Application Suite delivers solutions for roaming, interconnection and service-level agreement (SLA) monitoring.
  • The MaveriQ Management System provides network analytics and a presentation layer.

 

MaveriQ vProbes can be seamlessly deployed on third-party virtualization platforms with scaling elasticity and high availability (Figure 2). They use virtual network interface card (vNIC) and virtual switch (vSwitch) capabilities to non-intrusively monitor traffic on external network interfaces as well as internal VM-to-VM communication.

 

monitoring with virtual probes.JPG

Figure 2. MaveriQ vProbe is a virtual network function that can be deployed on third-party virtualization platforms.

 

Using MaveriQ vProbe, operators can rapidly increase network analytics capacity when needed, by adding vProbe instances on additional VMs on the same hardware, keeping CapEX and OpEX under control. The MaveriQ vProbe can be easily migrated between hosts which can be used to increase redundancy and eliminate application downtime during planned server maintenance.

 

MaveriQ can simultaneously monitor both virtual interfaces on cloud-based networks and physical interfaces. Data collected from both physical and vProbes can be analyzed, stored, and presented by a single central management and database solution which may be installed on either physical or virtual environment.

 

MaveriQ addresses multiple service provider needs in an NFV architecture, including customer experience monitoring, network performance monitoring, service optimization, marketing analytics, network planning, audits, and subscriber and network troubleshooting in a unified operational flow (Figure 3). MaveriQ employs a comprehensive array of performance and measurement methodologies to continuously analyze service and network performance, big data, and quality. Enhanced correlation capabilities give service providers full visibility of the network across technologies, while also providing the ability to drill down and troubleshoot to the session level and to see all the details of an operator’s traffic.

 

full diagram.JPG

Figure 3. Example of MaveriQ in a comprehensive service assurance and customer experience monitoring solution for NFV architecture.

 

Unlimited Scalability

MaveriQ is a unique solution optimized for terabit networks. Using advanced packet-processing technologies, MaveriQ vProbes offer low footprint and high capacity on a cost-effective platform. They have unlimited scalability, utilizing the ever-increasing CPU power, as well as built-in load balancing capability. One MaveriQ probe can simultaneously monitor LTE, 3G, 2G, VoLTE/IMS, VoIP, mobile core and wireline data signaling and user plane interfaces, dramatically reducing the number of probes required for monitoring multi-technology networks.

 

MaveriQ delivers the capacity to analyze hundreds or even thousands of Gigabits per second (Gbps) in real-time by utilizing technologies such as big data analytics engines, column-based data warehousing, massively parallel processing (MPP) and ultra-fast packet-processing techniques. The latter includes specifically Intel’s intelligent offload technology employing the latest Intel® Xeon® processors, accelerations in certain network controllers and the Data Plane Developer Kit (DPDK).

 

The Ideal MaveriQ Commodity Hardware Platform

Service providers looking to take advantage of the performance boost of Intel’s intelligent offload technology will find a number of solutions from members of the Intel® Internet of Things Solutions Alliance. The most powerful of these use the latest Intel® Xeon® processors.

 

For example, the Intel® Xeon® processor E5-2600 v4 family features up to 36 cores (and up to 72 threads) in a dual-socket configuration – 12 more cores than the previous generation. These processors are up to 44 percent faster with a 23 percent average generational performance gain across key industry-standard workloads and applications. In addition, the Intel Xeon processor E5-2600 v4 family delivers key improvements in virtualization efficiency that enhance application performance.

 

The processors deliver the greatest performance when paired with the Intel® Ethernet Controller XL710 product family (Figure 4). These 10- and 40-gigabit Ethernet controllers extend Intel® Virtualization Technology (Intel® VT) hardware assistance to network virtualization to reduce I/O bottlenecks by intelligently offloading networking traffic per VM, enabling near-native performance and VM scalability. For example, the controllers support standards-based offload overlays like Virtual Extensible LAN (VXLAN) and Network Virtualization using Generic Routing Encapsulation (NVGRE).

 

xl710 features.JPG

Figure 4. The Intel® Ethernet Controller XL710 product family provides a comprehensive feature set for extending Intel® Virtualization Technology (Intel® VT) hardware assistance to network virtualization.

 

An innovative offload feature, Intel® Ethernet Flow Director, directs packets to the core and application that requires them by observing outgoing flows and creating a connection between sources and destinations. The Intel Ethernet Flow Director supports up to 8,000 perfect match values extracted from sampled outgoing packets and stored on die to provide an efficient method for classifying packets and setting affinity of flows to cores.

 

The Intel Ethernet Controller XL710 product family is also optimized for DPDK. DPDK’s community-driven, open source packet-processing libraries maximize performance on Intel Xeon processors and the Intel Ethernet Controller XL710 product family. Running in the Linux* user space environment, DPDK assists in managing memory, buffers, queues, and flow classifications. Together, Intel Xeon processors, Intel Ethernet Controller XL710s and DPDK create a platform that can intelligently and rapidly process different data flows for NFV and the MaveriQ service assurance and customer experience management solution.

 

Put Service Assurance Front and Center in Your NFV Implementation.

Modernize probe functions and better support NFV architecture by transitioning from proprietary appliances to MaveriQ. For systems based on the Intel® Xeon® Processor E5 v4 product family, visit the Alliance’s Solution Directory.

 

 

Learn More

Contact feature member:

Solutions in this blog:

Related topics:

RADCOM is a General member of the Intel® Internet of Things Solutions Alliance.

 

Mark Scantlebury

Roving Reporter (Intel Contractor), Intel® Internet of Things Solutions Alliance

Editor-in-Chief,Embedded Innovator magazine

PLTRST signal never deasserts on boot

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I'm using the X-Powers PMIC and the Cherry Trail T3 package. On power up, all the core processor rails come up correctly; CORE_PWROK and VCCA_PWROK both go high; but the Cherry Trail never deasserts PLTRST#. This is preventing the system from fully booting. I haven't been able to find shorts in the board that might be causing the problem, and I've been through several reference designs and I think I'm matching them as closely as I can, but I still haven't been able to figure out what's wrong. To me it looks like the PMIC is working but something is going wrong on the Atom side. The datasheet states that PLTRST# should desassert when CORE_PWROK is stable and PMC_RSMRST is deasserted; when I scope CORE_PWROK it looks stable for 500ms before the PMIC resets, and PMC_RSTRST is deasserted stably. Is there another requirement for PLTRST# deasserting that I'm missing?

eepromARMtool

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Where do I find the eepromARMtool code?  I am working on an ARM based design that uses an i210.  I would like to program the NVM via this tool so that I can get the driver to load.

 

Regards,

Matt

TXE support for X5-E8000 and N3060 for embedded application

HD BMP tool

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Does anyone know why the HD Binary Modification Program(BMP) does not with Baytrail boards?

Also, where can I download the latest version of HD Binary Modification Program(BMP)?

 

Thanks

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