Designed for a wide range of demanding applications and platforms, such as unmanned systems, that require an extremely size, weight, power and cost (SWaP-C) optimized mission computer, Curtiss-Wright's DuraCOR 311 Mission Computer combines 64-bit quad-core Intel “Baytrail” Atom™ modular mission processing capabilities with integrated Intel HD graphics in a lightweight, ultra-small form factor rugged design. The new ultra-small mission computer weighs less than 1.5 lb and is less than 40 cubic inches in size - a fraction of the size/weight of traditional mission computers. Today, system integrators increasingly demand more and more processing power in the smallest possible rugged system envelope.

The DuraCOR 311 comes with a full complement of standard I/O interfaces (including USB, Ethernet, Serial, DIO, Video, and Audio). I/O expansion is supported by three Mini-PCIe expansion slots and the broad ecosystem of rugged COTS Mini-PCIe modules (including MIL-STD-1553 and ARINC 429 avionics databus interfaces). The DuraCOR 311 also features MIL-performance circular connectors and a fully dust and waterproof chassis. It is pre-validated through extensive environmental, power, and EMI compliance testing per MIL-STDs and DO-160. Both systems are designed to meet the demanding MIL-STD-810G, MIL-STD-461F, MIL-STD-1275D, MIL-STD-704F and RTCA/DO-160G environmental, power and EMI standards.

System Features:

• Miniature SWaP-optimized quad-core Intel Atom 3845 processor system:
  • Size: ~39 in³ volume (approx)
  • Weight: < 1.5 lb (< 0.68 kgs)
  • Power: <15W (estimated)
• Rugged IP67 chassis with micro-mini MIL-performance circular connectors
• Modular I/O architecture: up to three slots for PCIe Mini-Cards (for add-on I/O)
• Rugged Flash storage (mSATA / microSD card / removable 2.5” SATA SSD)
• 28 VDC MIL-1275/704/DO-160 power supply for aircraft and ground vehicles; optional 50ms power hold-up
• Qual testing pending for extreme MIL-STD-810G/DO-160 thermal, shock, vibration, altitude, humidity; also MIL-STD-461F/DO-160G EMI/EMC

请安装最新显卡驱动后再尝试。

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请检查一下VBIOS和GOP的版本和配置是否正确。

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目前还没有，具体内容请查看6th Gen Intel® Core™ Processors (U/Y-Processor Lines) Spec Update。

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因为Win8已经被Win8.1替代，所以Win8不在Skylake的支持列表中。建议使用Win8.1系统。

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目前没有8核16线程 还带GPU的。

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SDIO 3.0 is supported on Skylake-U.

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The retail industry knows that technology can increase sales and operational efficiency, but many retailers have limited budgets to invest in intelligent retail systems. The challenge for OEMs is finding ways to deliver point-of-sale (POS) systems, kiosks, and digital signage that deliver advanced features while keeping costs down. Below, I am providing links to some community posts on this topic that I think are particularly useful.  Digital Signage Top Picks have moved to a dedicated page.

Article: TOMRA, ADLINK and Enabling the Future of Reverse Vending Machines

Check out an innovative reverse vending machine solution built on the most robust, economical, and capable components such as ADLINK’s Express-IB computer-on-module (COM) based on Intel® processors,

Blog: Empowering Retail Associates with Tablets

Discover how tablets based on Intel® processors, integrated with the Intel® Retail Sensor Platform, can help increase store efficiencies, enhance sales associate productivity, and provide more personalized customer service.

Blog:  Using Beacons with the Intel® Retail Sensor Platform

Learn about the Intel Retail Sensor Platform, a complete platform for helping developers, solution providers, and system integrators quickly deploy retail solutions informed by analytics. This flexible, secure foundation enables better inventory tracking, faster time to insight from retail data, and new ways to increase customer satisfaction.

White paper:  Drive Smarter Retail Operations with Business Intelligence

Business intelligence (BI) is increasingly adopted by more savvy retailers in the highly-competitive environment.  Learn how retail analytics help retailers comprehensively collect and accurately analyze buying patterns and store operation data, turning raw data into actionable business insights.

Blog: Ringing Up POS System Sales with Intel® vPro™ Technology

The market for point-of-sale (POS) machines is extremely competitive, but POS designers can get an edge by appealing to two top retailer concerns: security and maintenance costs.  Learn how to solve these problems with Intel® vPro™ Technology. 

Blog: Next-Level Retail with 5th Generation Intel® Core™ Processors

5th generation Intel® Core™ processors improve security, manageability, and performance. Learn how they take retail computing to the next level.

Blog: Mobile Point-of-Sale Transforms the Store

Mobile point-of-sale (MPOS) completely changes the retail experience with on-the-spot transactions, easy upselling, and a personal touch. Explore the ways you can transform your store.

Article:  Personalize Retail with Secure Interactivity

Technology can power personalized shopping experiences throughout the store – whether a customer is viewing digital signage or interacting with sales staff. See how you can bring this tech to market with minimal cost and effort.

White paper:  Internet of Things Solution Improves Vending Machine Profitability

Check out a vending machine management and data analytics solutions that connects a fleet of machines to the cloud-based tools that can help generate more revenue and reduce maintenance effort..

Article:  Real-Time Content Management for Retail Displays

Retailers want to coordinate marketing campaigns across signage, kiosks, vending machines, and point-of-sale (POS) devices. Find out how the new Intel® Retail Client Manager (Intel® RCM) helps meet this goal.

Click here to browse retail computing solutions (including hardware and software elements of a retail system) based on Intel® architecture from Intel’s trusted embedded ecosystem, the Intel® Internet of Things Solutions Alliance.

Felix

J. Felix McNulty

Community Moderator

Intel® Embedded Community

(Intel contractor)

By Craig Szydlowski

To keep a factory operating smoothly, manufacturers need to keep a close watch over production status, equipment conditions, and operator activities. It’s a big challenge to collect all of the necessary data, and making sense of the numbers can be a real headache. What if a smart system could do all this automatically—and what if it could predict the future?

ADLINK recently demonstrated an end-to-end smart factory system that does just that. Its system combines machine sensors and controllers, smart cameras, IoT connectivity, and cloud-based business intelligence (Figure 1). By bringing these elements together, the system not only can monitor a production line in real time but also predict order fulfillment and maintenance needs.

Figure 1. The ADLINK demo includes an intuitive interface.

Predictive Quality and Maintenance

The heart of the system is the ADLINK PMQi, which intelligently automates production line quality and maintenance. This end-to-end data analytics platform was developed in collaboration with Intel and IBM, and uses Intel’s high-performance and highly secure hardware along with IBM’s Predictive Maintenance Quality (PMQ) Business Analytics platform.

The platform provides advanced analytics from the edge to the cloud. At the edge, the PMQi Cognitive Gateway runs a scoring engine to predict production line behavior and take corrective actions as needed. In the cloud, the IBM PMQ platform performs advanced analytics to reduce failure rates and predict maintenance needs.

ADLINK recently showcased a demo showing how these capabilities can also predict order fulfillment. When production is activated by an order, the system calculates an estimated time to completion and sends it to the business center in the cloud. If the production line is impacted by an event, like a change in conveyor speed, the system recalculates and reports the new completion time. If an operator hits the emergency stop button, the system halts production and informs the operations center.

A Fully Connected Factory

To monitor machine conditions and production status, the demo uses an ADLINK USB-2405 data acquisition (DAQ) unit to collect data from temperature, DC power voltage, and conveyor tension sensors. If a sensor measurement (e.g., temperature reading) exceeds a set limit, an alarm is sent to the operations center, the LED tower is triggered, and the production line is shut down. Operators can change system settings, such as the maximum operating temperature, via a configuration panel.

The demo also uses an ADLINK NEON-1040 smart camera to evaluate product quality. As products move on the conveyor, the camera performs optical character recognition (OCR) on the product labels. It captures high-resolution images, reports pass/fail status, and calculates the yield rate.

Data from the sensors and the camera are passed over to the ADLINK MXE-200i gateway, which in turn routes the data to the cloud. The gateway is based on Intel^® IoT Gateway Technology, which provides a robust platform for secure, reliable connected designs. To this foundation ADLINK has added APIs that enable easy connection to cloud infrastructure such as IBM Bluemix*, Microsoft Azure*, and Amazon Web Service* (AWS).

Machine Vision

Machine vision requires high image resolution and rapid frame rates. Excelling in both these areas, the ADLINK NEON-1040 (Figure 2) features 4-megapixel image capture at 60 frames per second (fps). The camera has a minimal footprint and a rugged IP67-rated construction to withstand harsh industrial environments. Its quad-core Intel^® Atom™ processor E3845 provides high-performance computing, and FPGA coprocessors and GPU deliver advanced image processing beyond the capabilities of conventional smart cameras.

Figure 2. The ADLINK NEON-1040 offers excellent performance.

The Intel® processor also makes it possible to connect a second camera to the NEON-1040 to capture images from other angles, further extending vision capabilities. Because it is based on an Intel® Atom™ processor, the camera offers flexible software development support, including GeniCAM*, GenTL* support for image acquisition, and OpenCV* and OpenCL* programming. With optional Microsoft* Embedded Standard 7, support for 64-bit instructions, onboard 2 GB RAM, and up to 32 GB storage, the NEON-1040 provides a stable, high-performance software operating environment for high-speed machine vision applications.

Complete Smart Factory Solution

Real-time production performance management, made easier by the IoT, can increase overall factory productivity. It is also possible to collect and analyze data to implement machine defect management and equipment failure analysis with the end goal of improving overall product quality and operations efficiency. This can be done using an ADLINK-based system that integrates machine vision, motion control, and the cloud with the help of Intel processors and IoT technologies. To see other industrial automation solutions from members of the Intel® Internet of Things Solutions Alliance, visit the Solutions Directory.

See the system in action.

ADLINK is a Premier member of the Intel® Internet of Things Solutions Alliance

Craig Szydlowski

Roving Reporter (Intel Contractor),Intel® Internet of Things Solutions Alliance

The new rugged 3U OpenVPX™ VPX3-1220 Processor Card from Curtiss-Wright features a low-power version of the Intel Xeon processor to provide high performance quad-core x86 processing with integrated graphics. This SBC is ideal for use in size, weight, power and cost (SWaP-C) constrained aerospace and defense systems. The VPX3-1220 is the first Xeon processor SBC designed to meet DO-254 Design Assurance Level (DAL) C. Available with certifiable DO-254 design artifacts, this powerful VPX module can greatly speed the deployment and certification of critical manned and unmanned airborne Safety Certifiable applications.

With up to 32 GB of high speed SATA flash memory and 512 KB user NVRAM, the VPX3-1220 is ideal for handling complex applications with demanding sensor processing requirements, or high speed data processing, logging and storage needs. Users can add a Curtiss-Wright XMC-554 storage mezzanine for up to 2 TB of additional storage in a single slot.

The VPX3-1220 is easily integrated with other members of Curtiss-Wright’s extensive 3U OpenVPX product family to develop powerful mission computing and ISR/EW systems.

Key Features:

• Intel “Skylake Xeon” 6th Gen processor based 3U VPX SBC
• Quad-Core (8-thread) E3-1505L CPU with Turbo
• Up to 32 GB DDR4 at 2133 MT/s supporting 34 GB/s
• Up to 32 GB SATA NAND flash
• Supports XMC expansion mezzanine
• Available in air-cooled and conduction-cooled versions

The VPX3-1220 is supported with an extensive suite of industry-standard operating systems such as Linux (Fedora and Red Hat Enterprise Linux (RHEL)), VxWorks, Microsoft Windows, VMware for virtualized applications environments, and 3rd party support for safety certifiable OS’s such as Wind River VxWorks 653, Green Hills INTEGRITY-178, or LynxOS-178.

请更新固件。

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方社区http://embedded.communities.intel.com/community/zh_cn，或者官方技术交流QQ

群120966104。

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不支持，没有显示接口（软件、硬件）。

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物联网（IoT）的迅速发展为医疗、智能家居、智能建筑和其他应用实现商业级和工业级 IoT 解决方案所需各种传感器的采购、连接和保护带来了挑战。Machina Research预测，设备连接将从2014年的50亿台急剧增长到2024年的270亿台。该公司估计，到2024年，69%的设备连接将是短距离无线通讯——楼内Wi-Fi*、低功耗蓝牙*（BLE）、ZigBee*、Thread和其他连接。

所有这些连接和无线技术极大地挑战了开发人员的连通性、硬件和固件专业知识，并对网络调试、安全、维护和设备管理的复杂性提出了巨大的挑战。 另外，为延长电池寿命，传感器和IoT网关制造始终面临的压力是需要将传感器更迷你化以消耗更少的功率。

总部位于都柏林的Firmwave公司（图 1）采用英特尔®Quark™微控制器（MCU）技术生产了创新型边缘传感器平台，以正面应对这一挑战。Firmwave*Edge*传感器平台是一套可定制、预验证的硬件和固件模块，用于加速下一代微型智能无线传感器的设计、开发和部署。

图 1：Firmwave Edge是一款基于英特尔Quark™微处理器D2000的创新型边缘传感器平台。

模块化Firmware Edge套装

Firmware Edge传感器平台套装包括支持如Zigbee、Thread、RFID、NFC、Wi-Fi、蓝牙、LoRa*、SIGFOX*和蜂窝等这类无线技术低功率、小型硬件和固件模块（图 2）。这些模块能简单可靠安全地在极低功率节点的网络边缘采集数据。它们便于调试、安装、管理和维持IoT网关上的大型传感器网络。

图 2: Firmwave Edge套装包括支持各种IoT无线技术的低功率、小型硬件和固件模块。

Firmwave Edge硬件参考设计以创新型模块、可堆叠传感器系统为特征，堪比传感器中的乐高*积木。 这些模块从根本上降低了硬件和固件定制的需求。该套装包括：

• 为开放式标准通讯协议提供本地支持的连接模块
• 采用降低安全启动技术和可信平台模块（TPMs）减少表面攻击区的安全模块
• 基于支持各种传感器类别和连接类型的内部、可完全扩展传感器中枢的传感器模块（图3）
• 让边缘可更新安全设备有额外处理能力及功能的信号处理模块
• 为智能建筑、智能办公室、资产追踪和物流提供定位解决方案的室内和户外定位模块

图 3：基于支持各种传感器类别和连接类型的内部、可完全扩展传感器中枢的传感器模块。

Firmwave Edge传感器在实时应用中支持微型操作系统，包括Zephyr* - 一种微型开放源码、可扩展实时操作系统。 Firmwave Edge信号处理库可靠地获取、集合、过滤并提供实时有意义的事件以避免频繁开启无线电线路，从而省电。就功率而言，Firmwave Edge传感器平台在微型纽扣电池或可使用寿命长达数年的再充电电池供电的节点上运作。 这一优点让这种模块化解决方案非常适用于于零售店、火车或公交车站的电子报或调度显示、不易进入地区的传感器以及许多其他需要长期解决方案的场景中。Firmwave提供的软件工具和固件平台，通过单个仪表板，将多个无线传感器网络技术的集成简化为单一部署。 其远程管理功能明显降低了设备的维护成本。Firmwave还为需要更多帮助的客户提供设计服务。 公司有一支技术娴熟的嵌入系统工程师和软件设计师团队，他们能在硬件和RF设计和布局、可行性和原型测试以及产品交付上帮助开发人员实现原型到商业级IoT产品的过程。 公司最近与HealthBeacon合作，开发了一种家用智能连接医疗依从性设备。 灵活、低功耗MCU保证了x86结构兼容性英特尔® Quark™ 微控制器D2000是一种低功率、电池操作、32位MCU，与其他初级MCU 相比，它的指令集更稳健。 英特尔® Quark™ 微控制器D2000 体积虽小，但包括了一个以32MHz 运行的超低功率内核和32k集成闪卡、8KB OTP内存以及8KB SRAM。英特尔® Quark™ 微控制器D2000将边缘智能带入了现实应用。 它能与其他基于英特尔的系统共同操作—将边缘产品的集成简化为端对端的IoT结构（图 4）。人们可以在设备级上进行更多操作，从而降低了各的。

图 4：与其他基于英特尔的系统共同操作英特尔® Quark™微控制器D2000—将边缘产品的集成简化为端对端的IoT结构与其他初级MCU.

相比 英特尔® Quark™ 微控制器D2000的输入/输出（I/O）选项充足，像Firmwave这类，选择它的公司能保证为客户提供真正灵活多样化的解决方案。 英特尔® Quark™ 微控制器D2000是用于智能标签、智能阅读器、传感器和设备控制器、显示控制器、电机控制器等的理想之选。这一款MCU的工业温度范围（-40°C到+85°C）以及IoT设备10年的可靠性是其用于各种解决方案的可靠保证。 就安全性而言，英特尔®Quark™ 微控制器D2000的基于软件和硬件的特性，将英特尔的安全性延伸到设备级，有利于每一个端点的数据保护。微型、超低功率的边缘传感器带来了巨大的影响Firmwave Edge传感器平台展现了将英特尔技术智能运用于IoT边缘的可行性。 如需了解更多使用英特尔Quark微处理器和SOC的低功率、微型传感器和网关，请参考聯盟的解决方案目录。

Firmwave是Intel®物联网解决方案联盟的General级会员。

Mark Scantlebury

流动记者（英特尔合约记者），英特尔®物联网解决方案联盟

Embedded Innovator杂志总编辑

随着物联网行业内竞争日益加剧，开发人员不仅面临产品性能、特点方面的竞争压力，还要面临价格竞争。如果一种方案能够实现低能耗、多任务处理的目标，那就最好不过。

实现上述目标，增强物联网入门级设备竞争优势就要利用英特尔新推出的64位系统芯片（SoC）所支持的主板和系统。 14纳米的英特尔x5-E8000 Atom™处理器于2月份推出，大大降低了四核64位计算成本，这一点适用于任何使用该处理器的产品。 与目前建议价格相比，这种芯片价格比22纳米的英特尔E3845 Atom™处理器低将近25%，比英特尔Pentium®和Celeron®处理系统产品中使用的最便宜的14纳米系统芯片也要低60%。

但价格只是一部分。 英特尔x5-E8000 Atom™处理器只需5W热设计功耗（TDP）——仅为上一代产品的一半功耗，就可实现四核性能。 这使得开发人员能够以低成本、低能耗保持同样或更加完善的x86生态系统。

推动对这种系统芯片需求的主要因素在于，人们逐渐意识到，即使是最高端、最分散的云架构也无法处理数以亿计的关联设备所需物联网数据流量。 边缘设备的过滤、局域分析、加密和解密服务以及病毒防护功能能够减轻云负担。 而且，在延时敏感处理和实时功能环境下，边缘处理可以保障产品的高性能。

作为入门级设备，英特尔x5-E8000 Atom™处理器性能的关键在于系统芯片，其特点包括：

• 第八代Intel® 12组执行单元高清显卡
• 2MB二级缓存
• 8GB DDR3L-1600 RAM双通道存储控制器
• Intel®高速视频同步技术与英特尔清晰视频高清晰技术能够迅速完成视频切换，播放生动清晰、色彩鲜明。
• 可支持三种显示器（eDP, DP, HDMI），分辨率高达4K。
• 采用Intel®虚拟化技术（VT-x）
• Intel®进阶加密指令集与安全密钥实现加强型硬件辅助加密与解密功能。
• OpenGL与Microsoft DirectX支持
• 七年有效性

已推出的四款主板

第一款采用超低价位主板和搭载新处理器的模块就是congatec。使用新处理器更新两个嵌入式计算机模块、一个Qseven模块以及2015年最新的Mini-ITX主板设计。四款congatec主板的物联网应用包括嵌入式移动设备、产业网关、数字看板、终端机以及票与现金记录系统。另外还有紧凑型工业与交通用计算机和医疗设备。

congatec为微软 Windows 10，8，7，Windows embedded 8，7以及所有常见的Linux发行版提供板级支持包（BSPs）。 该支持包包括congatec旗下一些常用详尽文档、行业兼容驱动程序以及个人集成支持，加快了个人设计开发与效益提升的速度。

主板

congatec的Mini-ITX主板，Conga-IA4，大小为170mm x 170mm（图1）。该主板的主要特点在于端口种类繁多，包括2个吉比特以太网端口、2个USB 3、2个USB 2.0、耳机插座以及2个显示端口。同时还有LVDS与eDP内建接口、2个MIPI CSI-2摄像机连接端口。主板上有三个PCIe插槽，其中有一个是与mSATA共用的。

图 1. Conga-IA4主板的特点在于针对入门级Mini-ITX主板接口较多。 

Conga-QA4 (70mm x 70mm)采用Qseven形状，可支持8GB内存以及64GB内嵌式闪存（图2）。与Mini-ITX主板一样，它包括两个MIPI CSI-2摄像头接口，一个D示器插口，一个智能电池管理模块。

图 2. Conga-QA4为Qseven形状，具有内建式HDMI /显示器插口以及智能电池管理模块。

Conga-MA4为COM Express Type 10迷你模块，大小为84mm x 55mm，支持4GB内存以及32GB内嵌式闪存（图3），包括3个PCIe，一条5GB/s的线路，2个SATA 3，2个USB 3.0，8个USB 2.0，LPC总线，一个串行外设接口，1²C总线，2个UART，SM总线以及SDIO接口。

图3. Conga-MA4为I/O端口丰富的COM Express Type 10迷你模块。

Conga-TCA4针对需要COM Express Type 6紧凑型模块的计算机， 大小为95 mm x 95 mm，支持8GB内存，没有板载闪存（图4）。I/O端口包括5个 PCIe，4个USB 3.0，8个USB 2.0，2个 SATA 3，LPC总线，SPI，1²C总线，2个UART以及SDIO接口。一个MIPI CSI-2摄像头接口可选。

图 4. Conga-TCA4是带有四个USB 3.0端口的COM Express Type 6紧凑型模块。 

敬请期待更多边缘设备中的创新产品

新推出的英特尔x5-E8000 Atom™处理器以及四款采用该处理器的congatec主板必定会激发新设计的产生。 要获取更多搭载英特尔系列处理器的解决方案灵感，请参见解决方案目录中列出的超过2600种主板，通过"特点"筛选功能找到最符合您需求的产品。

Congatec是Intel®物联网解决方案联盟的Associate级会员。

Mark Scantlebury流动记者（英特尔合约记者），英特尔®物联网解决方案联盟Embedded Innovator杂志总编辑

The Internet of Things (IoT) is all about bringing the worlds of embedded and IT together. The question is how to unite these disparate technologies. Few companies have expertise in both embedded design and Big Data. Fewer still know how to combine these domains.

That’s why new offerings like the Advantech IoT Gateway Starter Kits* illustrated in Figure 1 are so important. These kits offer an end-to-end solution that makes it much easier to connect embedded devices to commercial cloud service like those from Microsoft, IBM, and Amazon. With these kits, companies can focus their design efforts on analytics and decision support rather than contentious configuration details.

Figure 1. The Advantech IoT Gateway Starter Kit in the context of an IoT application.

The Advantech approach begins with two ready-to-run industrial gateways—the ARK-1123H and ARK-2121L—based on Intel^® IoT Gateway Technology and boasting a number of powerful features. But what makes the kits truly significant is the software that enables a smooth path from sensor to cloud.

Cloud Platform Built in

Most notably, the kits come with the WISE-PaaS/RMM cloud software, which can run on Microsoft Azure*, IBM Bluemix*, and Amazon Web Services* (AWS). The cloud platform provides a number of functions:

• Data acquisition from the sensors
• MQTT protocol support for communications to the cloud
• Remote control for the gateway system and I/O, dashboard console
• Gateway monitoring to examine connected device and software conditions through a dashboard and system management console
• More than 100 RESTful APIs, a popular type of standard web service for remote control and IoT application development
• Node-RED application logic designer

Node-RED deserves particular attention for companies that aren't accustomed to designing and deploying embedded systems. A drag-and-drop interface allows engineers or IT professionals to design implementations without the need for embedded coding experience. Companies can quickly and easily build an IoT automation and data flow implementation.

Running on the gateway hardware is the WISE Agent software. It handles communications with the sensors, or the devices reporting up sensor results, whether through common serial I/O protocols, Wi-Fi, Ethernet, digital I/O, or USB, and bridges communications through the MQTT protocol to relay data to the cloud. The WISE Agent also responds to the RESTful APIs for remote control and IoT application development, so the cloud application built with Node RED, further customized in either C++ or C#, can fulfill sophisticated needs. The WISE Agent also consolidates the data and performs any processing requirements, so what the cloud receives is only what it needs.

The building-block development approach and automated communications and processing capabilities help companies undertake IoT development without having access to dedicated embedded development resources. In addition, professional technical support and access to a developer forum community help companies get the assistance they might need.

Powerful Hardware

Critical to the success of the IoT Gateway Starter Kits is the quad-core Intel® Celeron® processor J1900. The chip provides two major advantages to the kits. One is Intel® Active Management Technology, or Intel® AMT, which allows third-party management applications to better manage, repair, and control hardware, even when powered down. Even if a device is non-responsive at the OS level, software from the cloud can fix problems in the BIOS or restart the system.

In addition, the Intel Celeron J1900 processor comes with Intel McAfee Security Support*. Security is a major concern in IoT to keep hostile parties from interrupting activity or using an IoT device as a door into major systems.

Easier IoT Design

The Advantech kits are just one example of how members of the Intel® Internet of Things Solutions Alliance are simplifying IoT design. To see other IoT gateway solutions from members of the Alliance, visit the Solutions Directory.

Advantech is a Premier member of the Intel® Internet of Things Solutions Alliance

Kenton Williston

Roving Reporter (Intel Contractor),Intel® Internet of Things Solutions Alliance

Hi everyone,

My board is installed with DH8920 and E5-2658 to implement IPsec decryption and encryption. I wanna reach 20Gbps throughput for IPsec which is declared in DH8920 product document.

DPDK and QAT driver is installed and my application software is very similar with the example "dpdk_qat" provided by QAT1.5 with some changes to handle with the IPsec encapsulation.

QAT is used in user space with DP API.

In my host application I enable 8 logical cores and each core uses 1  instance for qat and has 1 rx queue for dpdk.  So since there are only four engines for crypto, every 2 instances with ring size set to 4096(max value I can configure) share 1 engine.

But when I test with the performance of the application I encounter 1 problem. Hopefully someone can help me.

If I Send more than 10Gbps (11Gbps) IPsec encrypted pkts to my board with iperf3 tool, I find that  sometimes for most of the instances CPA_STATUS_RETRY is returned after capCySymDpEnqueueOp is called leading to a lot of pkts lost, and after a while it recovered to normal. I know this means the request queue of QAT is full and nothing more can be put into it. Since the document tell us the DH8920 supports 20Gbps, I am really puzzled about:

1) Why could the request queue of QAT be full for somewhile when the traffic is only 11Gbps more or less? If it reaches the max capability why does that happen only for sometimes.

2) When that happen I increases the frequency of polling the responses by icp_sal_CyPollDpInstance, but no use and I find nearly 98% of results of icp_sal_CyPollDpInstance, are  CPA_STATUS_RETRY.

3) I just adjust all the parameters in dpdk_qat  like polling frequency and the frequency of setting PerformNow to CPA_TRUE as the intel QAT performace document recommanded.

It seems that sometimes for the qat instance there are only requests accumulating without any responses leading to tx queue full and after a while a lot of responses come out in a short time leading to recovery.

How can I find the reason and increase the performance to 20Gbps without any request queue of QAT full? by the way, if the performance is 20Gbps, how many is for 1 instance or 1 crypto engine which is not mentioned in document.

Thanks a lot !

Best regards,

Hello,

Does intel provides any software application/solution which can provide estimate of power consumption/dissipation by the intel atom processor E3800 series?

Thanks & Regards

Gaurav

Curtiss-Wright’s Defense Solutions division has begun shipments of its family of rugged Digital Signal Processing (DSP) engine modules based on the Intel® Xeon® processor D (code-named "Broadwell-DE"). The open architecture compute engines, designed for use in very compute-intensive C4ISR aerospace and defense applications, are the industry’s first to deliver supercomputing-class processing to rugged 3U and 6U VPX architecture COTS environments. 8-core and 12-core versions of the Xeon processor D-based small form factor 3U OpenVPX™ CHAMP-XD1 and Early Access Unit versions of the 6U OpenVPX CHAMP-XD2 DSP modules have already been delivered and are currently under evaluation by almost all of the aerospace and defense market’s leading Tier 1 and Tier 2 Prime Contractors.

The CHAMP-XDx module family delivers unprecedented Intelligence, Surveillance and Reconnaissance (ISR) processing capabilities to embedded systems deployed in airborne and ground, manned and unmanned programs. The CHAMP-XDx module family is designed for the most demanding deployed High Performance Embedded Computing (HPEC) systems, including next-generation Radar, EW and a wide range of C4ISR applications.

CHAMP-XD1 3U OpenVPX Xeon D-based DSP Processor Card	CHAMP-XD2 6U OpenVPX Xeon D-based DSP Processor Card
Key Features Intel Xeon D 8-Core (410 GFLOPS @ 1.6 GHz) or 12-Core (576 @ 1.5 GHz) Extended operating temperature Intel eTEMP SKUs PCH integrated in Xeon D SoC Native dual KR 10 GigE ports 16 to 32 GB DDR4 @ 2133 megatransfers per second (34 GB/s aggregate) XMC PCIe up to Gen3, designed for up to 25W thermal dissipation PCIe Gen3 on 3U OpenVPX data plane with switch Core Function FPGA with IPMI Rugged conduction and air-cooled versions available TrustedCOTS	Key Features Dual processor Xeon D 8-core (820 GFLOPS @ 1.6 GHz total) or 12-core (1152 GFLOPS @ 1.5 GHz total) Extended operating temperature Intel eTEMP SKUs PCH integrated in Xeon D SoC Four ports of 40G/10G Ethernet or DDR/QDR/FDR10 InfiniBand on OpenVPX data plane Native dual KX 1 GigE or KR 10 GigE ports on OpenVPX control plane 16 to 32 GB DDR4 @ 2133 megatransfers per second per Xeon D socket (68 GB/s aggregate) XMC PCIe up to Gen 3, designed for up to 25W thermal dissipation Dual x16 PCIe Gen 3 on OpenVPX expansion plane with switch Core Function FPGA with IPMI Rugged conduction and air-cooled versions available TrustedCOTS

One of the big challenges with IoT design is integrating all of the sensors. A typical IoT deployment has multiple sensors—such as temperature, humidity, and motion sensing—as well as multiple communication protocols—including Wi-Fi*, ZigBee*, and Bluetooth* low energy, to name a few. Sorting out all the firmware for the various sensors and networks can be a time-consuming and tedious process.

American Megatrends, Inc. (AMI) is attacking this problem with tools that abstract the sensor interfaces. By providing a modular, plug-and-play approach, AMI says it can significantly speed up the early stages of the development cycle.

Modular Firmware

The foundation of the approach is the AMI RTOS* and its accompanying integrated development environment (IDE), shown in Figure 1.  The IDE centers around schematics that show how sensor interfaces tie to pins of the system’s embedded controller. Developers need only select their preferred RF modules and sensors, and the dev environment will automatically produce customized firmware.

Figure 1. The AMI RTOS* is accompanied by an integrated development environment (IDE).

Because developers no longer need to learn the details of each interface, development time can be reduced significantly. In addition, this plug-and-play functionality makes it easier to swap components when design requirements change.

Sensor Hubs

The RTOS provides additional functionality needed to construct a sensor hub, such as a web-accessible device management user interface. Indeed, the RTOS is just one element in AMI’s larger offerings for IoT designs. As shown in Figure 2, AMI offers solutions that extend from the sensor hob to the IoT gateway and even into the cloud.

Figure 2. AMI's scalable IoT solution architecture.

IoT Gateways

Devices running the RTOS can communicate with a gateway that runs AMI LINUX*. The OS is designed to enable efficient administration. For example, to add a new gateway or sensor array to the network, you scan a QR code into an app on a mobile device.

The gateway OS has multiple fail-safe mechanisms. If replacing hardware is necessary, getting operational again is straightforward with restoration of previous configurations, whether through a factory image restore option, image reinstall with a USB key, or directly from the cloud.

Efficient Edge Processing

Although AMI’s solutions can be used with any Intel® processor, the company sees particular advantages to using Intel® Quark™ processors. These processors have low energy needs as you would expect in embedded and IoT applications, and yet provide more performance per watt than other chips. That translates into important advantages in operations.

If sensor data needs significant filtering, an Intel Quark processor can handle that workload—along with some heuristics—at the sensor hub. Pushing this processing all the way out to the sensor hub frees the gateway up for other tasks. Hub-level filtering also reduces unnecessary data transmission, allowing gateways to communicate with more sensors than would otherwise be possible.

Cloud Connectivity

AMI LINUX provides connectivity to such popular cloud options as Amazon AWS*, Microsoft Azure*, and IBM Bluemix* to complete the data path. Developers can also use AMI CLOUD SERVICES, a private cloud service designed by AMI for IoT management and use.

AMI CLOUD offers significant administrative and operational advantages, like fail-safe backup for all sensor hubs and gateways. AMI CLOUD additionally protects uptime with a many-to-many rule engine that manages sensor rollover in case of a negative event. Robust data analytics close the loop so companies can make use of the collected sensor data and make results available for further data analysis and decision support.

Take the Pain out of IoT

In short, AMI’s software stack takes much of the pain out of IoT sensor integration—and it provides a convenient path to the cloud. To see other firmware and OS solutions from members of the Intel® Internet of Things Solutions Alliance, visit the Solutions Directory.

American Megatrends, Inc. is an Affiliate member of the Intel® IoT Solutions Alliance.

Kenton Williston

Roving Reporter (Intel Contractor), Intel® Internet of Things Solutions Alliance

Hi,

I am integrating an I210-IT onto a breakout card and have run into a problem getting it up and running. we are using the I210 internal PHY in flash less mode.

• I first used the lanconfw64e tool to check the I210 was visible as a blank device
• I then used the EEUPDATEW64e tool to load the "I210_Invm_Copper_APM_v0.6.txt" image. The updater tool said this completed successfully.
• I used the lanconfW64e tool to re check the visibility of the device and it is now recognized as "Intel<R> I210 Gbit Network Connection". I also checked the registers which are now updated with new data.
• I then downloaded the Intel drivers from the Download center and installed. This said it completed successfully.

I now have a yellow triangle on the image in device manager and the following error "failed to initialize adapter (code 10)"

Re running the lanconfW64e tool i get the following message

And if i open the resource as suggested i get the following

Any help would be appreciated as a little lost on this one.

Kind Regards

Robert